Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Siddartha Kondoju"'
Autor:
Kunal Shrotri, Jin Lu, Jim Hofmann, Thy Tran, Phillip J. Ireland, Allen McTeer, Vasil Antonov, Dale W. Collins, Nicolai Petrov, Hongqian Sun, Greg Herdt, Joseph T. Lindgren, Pratap Murali, T. Owens, Stefano Guerrieri, Rita J. Klein, Siddartha Kondoju, Shane Trapp, Yushi Hu, Kevin Titus
Publikováno v:
ECS Transactions. 50:53-72
The demand for low resistance metallization solutions has become an increasingly important issue as interconnect line sizes have approached and in some cases become smaller than the electron mean free path in Cu. Formation of reliable small damascene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00e51c922c3cc814176b8bd4894f8bab
https://doi.org/10.1149/05039.0053ecst
https://doi.org/10.1149/05039.0053ecst
Publikováno v:
MRS Proceedings. 914
Slurries used for copper CMP have a rich chemistry, which may change during the course of polishing due to consumption and decomposition of molecular species. Various aspects, such as small layer thickness (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66ada66a4011c325227ea654a2626743
https://doi.org/10.1557/proc-0914-f12-02
https://doi.org/10.1557/proc-0914-f12-02