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pro vyhledávání: '"Siamak Mogharrabi"'
Autor:
Bryan S. Kasprowicz, Patrick Reynolds, Martin Carrier, Siamak Mogharrabi, Corey Shay, Andrew Zanzal, Keith Best
Publikováno v:
2020 International Wafer Level Packaging Conference (IWLPC).
In the next few years, advanced process technologies in advanced packaging fabs will migrate rapidly to reduction lithography to achieve 2/2 RDL and beyond. Reticle enhancement techniques, such as Optical Proximity Correction (OPC) may be required in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46429a5a8c2d2daec6eb078a3446b44e
https://doi.org/10.23919/iwlpc52010.2020.9375898
https://doi.org/10.23919/iwlpc52010.2020.9375898
