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Although pre-laser decapsulation reduces the time to acid exposure for subsequent chemical decapsulation of copper wirebonded devices, it can result in severely damaged or broken copper wirebonds if carried out at a focused depth followed by chemical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1392::4954c7229213a49cb2429175c64fdab6
http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=/asset_publisher/view_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices
http://www.asminternational.org/web/edfas/technical?p_p_auth=ob3PcFz5&p_p_id=101&p_p_lifecycle=0&p_p_state=maximized&_101_struts_action=/asset_publisher/view_content&_101_assetEntryId=22674956&_101_type=content&_101_groupId=10192&_101_urlTitle=laser-focus-depth-adaptation-for-decapsulation-of-copper-wirebonded-devices
