Zobrazeno 1 - 2
of 2
pro vyhledávání: '"SiYeul Yoon"'
Autor:
Olivier Moreau, Ivan Yao, Kuang-Chao Chen, Tuung Luoh, Alex Cheng, Hsiang-Chou Liao, Ling-Wu Yang, SiYeul Yoon, Tahone Yang, Chih-Yuan Lu, Hong Xiao, Steve Lin
Publikováno v:
2013 e-Manufacturing & Design Collaboration Symposium (eMDC).
In this paper we studied capturing buried void defects in copper (Cu) wires using an electron beam inspection (EBI) system. These are defects of interest (DOI) to integrated circuit (IC) manufacturers because typical defect inspection techniques cann
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8cf0ee31ce0f2e1e2d45776865df1754
https://doi.org/10.1109/emdc.2013.6756067
https://doi.org/10.1109/emdc.2013.6756067
Autor:
Liao, Hsiang-Chou, Tuung Luoh, Ling-Wu Yang, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu, Steve Lin, Cheng, Alex, Yao, Ivan, SiYeul Yoon, Moreau, Olivier, Xiao, Hong
Publikováno v:
2013 e-Manufacturing & Design Collaboration Symposium (eMDC); 2013, p1-4, 4p