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pro vyhledávání: '"Shyuan-Jeng Ho"'
Optimization of the output power by effect of backsheet reflectance and spacing between cell strings
Autor:
Shyuan-Jeng Ho, Wen-Hsuan Liao, Chiu-Hua Huang, Ming-Yuan Huang, Zhen-Cheng Wu, Yi-Chia Chen, Wei-Sheng Su, De-Chih Liu
Publikováno v:
2011 37th IEEE Photovoltaic Specialists Conference.
In the cell to complete module process, the cell to module (CTM) loss is inevitable. In typical process, the CTM power loss is larger than 3%. In this letter, we tried to reduce the CTM loss by studying the backsheet reflectance and the string inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c367fdc6db04f877e57e75584351baa6
https://doi.org/10.1109/pvsc.2011.6186624
https://doi.org/10.1109/pvsc.2011.6186624
Publikováno v:
2011 37th IEEE Photovoltaic Specialists Conference.
Yellowing of modules represents the most evident visual defect. It appears on 98% of the plant modules and, for 63% of panels, it strongly covers their entire background tedlar. In order to see if this yellowing effects the output of the modules the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0205d5cdac21627fea3ad5c44cc6e5ba
https://doi.org/10.1109/pvsc.2011.6186609
https://doi.org/10.1109/pvsc.2011.6186609
Publikováno v:
2011 37th IEEE Photovoltaic Specialists Conference.
PECVD SiO x thin film combined with SiN x :H layer was used as dual anti-reflecting coating (DARC) to minimize surface reflectance. The advanced DARC enhanced cell efficiency of mono-crystalline and multi-crystalline Si solar cells by 0.15% and 0.31%
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0137205278ab241e05892c0e08e33f54
https://doi.org/10.1109/pvsc.2011.6186376
https://doi.org/10.1109/pvsc.2011.6186376
Publikováno v:
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdd44bab67bc1e729d9d3ad18079b3f9
https://doi.org/10.1109/iemt.1992.639904
https://doi.org/10.1109/iemt.1992.639904
Publikováno v:
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium; 1992, p277-282, 6p