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pro vyhledávání: '"Shyama Mukherjee"'
Publikováno v:
MRS Proceedings. 613
The present work describes the process principles of “Spin-Etch Planarization” (SEP), an emerging method of planarization of dual damascene copper interconnects. The process involves a uniform removal of copper and the planarization of surface to
Publikováno v:
ECS Meeting Abstracts. :380-380
not Available.