Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Shuying Ma"'
Publikováno v:
Molecules, Vol 29, Iss 18, p 4362 (2024)
The decomposition mechanisms of Fe(EDTA)− and Fe(EDTMP)− complexes, widely used in various industrial applications, were investigated through a theoretical approach. Despite their structural similarities, the phosphonic acid and carboxylic acid g
Externí odkaz:
https://doaj.org/article/3d4e94e70f2d4c058727a32429d94f58
Publikováno v:
Frontiers in Earth Science, Vol 11 (2023)
Externí odkaz:
https://doaj.org/article/ad642a2f7c9b4a469751f57dd2d972b4
Publikováno v:
Frontiers in Earth Science, Vol 11 (2023)
The extraction of gas-bearing information from the deeply underground reservoir is extremely difficult due to the weak seismic response and complicated gas distribution characteristics. To predict gas-bearing reservoirs efficiently, we developed a de
Externí odkaz:
https://doaj.org/article/34645b6b7d954670af27358203d57c0c
Autor:
Jiancheng Qin, Lei Gao, Weihu Tu, Jing He, Jingzhe Tang, Shuying Ma, Xiaoyang Zhao, Xingzhe Zhu, Karthikeyan Brindha, Hui Tao
Publikováno v:
Energies, Vol 15, Iss 15, p 5526 (2022)
China faces a difficult choice of maintaining socioeconomic development and carbon emissions mitigation. Analyzing the decoupling relationship between economic development and carbon emissions and its driving factors from a regional perspective is th
Externí odkaz:
https://doaj.org/article/40dbfdc1110244febd723863856e8bee
Publikováno v:
IEEE Transactions on Nuclear Science. 69:1148-1156
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::858e69d99e05fd15b0a0733a0ebd8393
https://doi.org/10.1109/tns.2021.3138077
https://doi.org/10.1109/tns.2021.3138077
Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application
Publikováno v:
Sensors, Vol 20, Iss 15, p 4077 (2020)
To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to
Externí odkaz:
https://doaj.org/article/0304a86a10a74db88de3e0000b41ea49
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd1d37f9ce3873710fbe92a5e46521c6
https://doi.org/10.1109/icept56209.2022.9873460
https://doi.org/10.1109/icept56209.2022.9873460
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efd849ff255a9c90d6dafa4c25e57ebb
https://doi.org/10.1109/icept56209.2022.9873479
https://doi.org/10.1109/icept56209.2022.9873479
Publikováno v:
Microsystem Technologies. 27:4121-4125
3D WLCSP with via last TSV and UV laser releasable temporary bonding technologies is an ideal scheme to meet the increasing high performance, low cost and small-form-factor requirements. In present paper, we demonstrate a thin 3D WLCSP process using
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b72d2a571a70cb01a733dcd88ec2d4d9
https://doi.org/10.1007/s00542-021-05228-x
https://doi.org/10.1007/s00542-021-05228-x
Autor:
Shuying Ma, Kai Zhang
Publikováno v:
Mobile Information Systems.
The low-altitude photogrammetry technology of unmanned aerial vehicles (UAVs) is widely used in many fields, but the absence of analysis and research affects the accuracy of its data products. At the same time, low-altitude photogrammetry faces the p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a7c7ce0ab5d8120e326f9af1689d19f7