Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Shurong Tian"'
Autor:
Zhongcan Peng, Shurong Tian, Hailing Li, Longping Zhu, Zhimin Zhao, Guodong Zheng, Qiyin Wen, Hongru Tian, Depo Yang
Publikováno v:
Food Hydrocolloids. 136:108237
Autor:
Shurong Tian, Todd E. Takken, Chris Marroquin, Mark D. Schultz, Anil Yuksel, Mark K. Hoffmeyer, Vic Mahaney
Publikováno v:
Journal of Electronic Packaging. 143
A new era of computing has begun with the development of high-performance computing (HPC), artificial intelligence (AI), machine learning (ML), and cognitive systems. Dramatic increases in the power density of the electronic components have led to th
Autor:
Chris Marroquin, Mark K. Hoffmeyer, Shurong Tian, Mark D. Schultz, Anil Yuksel, Vic Mahaney, Todd E. Takken
Publikováno v:
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
High performance computing (HPC), artificial intelligence (AI) and cognitive systems have initiated a new era of computing. Efficient thermal management technologies of these systems have been vital due to the increasing power density in the electron
Autor:
Michael J. Ellsworth, Todd E. Takken, Shurong Tian, Howard V. Mahaney, Mark D. Schultz, Paul W. Coteus, Chris Marroquin, Yuan Yao, Anil Yuksel, Kevin M. O'Connell
Publikováno v:
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
For high-speed computer systems, the high-power devices such as Central Processor Units (CPUs) and Graphics Processing Units (GPUs) generally must be arranged close together to reduce electrical channel routing distances. In such cases water cooling
Autor:
Yuan Yao, Kevin M. O'Connell, Todd E. Takken, Anil Yuksel, Mark K. Hoffmeyer, Paul W. Coteus, Christopher M. Marroquin, Mark D. Schultz, Shurong Tian, Vic Mahaney
Publikováno v:
IBM Journal of Research and Development. 64:5:1-5:12
Achieving optimal data center cooling efficiency requires effective water cooling of high-heat-density components, coupled with optimal warmer water temperatures and the correct order of water preheating from any air-cooled components. The Summit and
Publikováno v:
ITC
Multilayer (3D) integrated circuit technology (3D chip technology) provides an attractive alternative to conventional circuit scaling methods, which rely solely on continued shrinking of device dimension. Chip stacking, through the use of through sil
Publikováno v:
Heat Transfer Engineering. 24:4-16
The effect of surface roughness on pressure drop and heat transfer in circular tubes has been extensively studied in literature. The pioneering work of Nikuradse [1] established the sand grain roughness as a major parameter in defining the friction f
Autor:
Daniel M. Kuchta, Mark D. Schultz, Shurong Tian, Clint L. Schow, Christian W. Baks, Fuad E. Doany, Frank R. Libsch, Alexander V. Rylyakov
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
A novel optical transceiver with 4 transmitter plus 4 receiver channels designed for coupling to multicore multimode fiber has been fabricated and characterized. The transceiver is based on the holey Optochip concept where 4-channel VCSEL and photodi
Autor:
Xiaoshu Sun, Shurong Tian
Publikováno v:
2010 2nd IEEE International Conference on Information Management and Engineering.
In Probability Hypothesis Density (PHD) particle filter for tracking multiple targets, a new peak extraction method was studied. Firstly, we draw the largest weight particle, when the sum of all particle weights in its neighborhood is larger than tar
Publikováno v:
CIS (2)
In this paper, we represent multi-target state and ambiguous measurement as random sets, use ambiguous likelihood to fuse ambiguous data for tracking multiple targets, and we implement multi-target tracking with probability hypothesis density (PHD) p