Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Shun Ya Lv"'
Publikováno v:
Materials Science Forum. 943:3-7
Due to its specific structural features, the packaging technology is quite essential for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e06c1179e4f6e3332713efa14bf75ead
https://doi.org/10.4028/www.scientific.net/msf.943.3
https://doi.org/10.4028/www.scientific.net/msf.943.3
