Zobrazeno 1 - 10
of 46
pro vyhledávání: '"Shun Meen Kuo"'
Publikováno v:
IEEE Transactions on Advanced Packaging. 26:433-440
Copper/low-k structures are the desired choice for advanced integrated circuits (ICs). Nevertheless, the reliability might become a concern due to the considerably lower strength and greater coefficient of thermal expansion (CTE) of the low-k materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc77cc932e0ca1bc2535bcb09c9968fd
https://doi.org/10.1109/tadvp.2003.821084
https://doi.org/10.1109/tadvp.2003.821084
Autor:
Shun Meen Kuo, Wenbin Jiang, S. Tapp, James H. Knapp, Philip Kiely, S. Planer, Davis H. Hartman, Daniel B. Schwartz, Christopher K. Y. Chun, Stephen G. Shook, J. Sauvageau, Paul R. Claisse, Francis J. Carney, Chan Long Shieh, B.M. Foley, Craig A. Gaw, Laura J. Norton, Glenn Raskin, Michael S. Lebby
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B. 19:532-539
Summary form only given. The optical waveguides have a uniformity of 1 dB. The resulting optical links have a jitter of no more than 150 ps not including pulse-width distortion, static skew between channels of less than 200 ps and dissipate 1.5 W. A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5c07b71fd9f645b02d5d4257940b0f3
https://doi.org/10.1109/96.533892
https://doi.org/10.1109/96.533892
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Miniaturization of consumer electronic devices is increasing demands to reduce the size of Power Management Integrated Circuit (PMIC) devices. In addition, the integration of additional functionality on a single chip is increasing the package's I/O c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::355000616f6224d274cd65d2db93213b
https://doi.org/10.1109/ectc.2010.5490957
https://doi.org/10.1109/ectc.2010.5490957
Autor:
M. Tutt, Shun-Meen Kuo
Publikováno v:
2008 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
In the de-embedding methodologies used to characterize semiconductor devices on Si substrates, the short standards are assumed to be perfect. However, in practice, there are parasitics associated with the connections to the ground of the short standa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf54e20c7e17ae3fac824222b9a5423a
https://doi.org/10.1109/bipol.2008.4662752
https://doi.org/10.1109/bipol.2008.4662752
Autor:
Sergio Pacheco, Shun-Meen Kuo, C. Ramiah, Scott D. Marshall, M. Watts, Lianjun Liu, Qiang Li, Melvy F. Miller, P. Piel
Publikováno v:
2007 IEEE/MTT-S International Microwave Symposium.
An integrated passive device (IPD) technology has been developed for wireless basestations applications. The technology features 6-mil GaAs substrates, airbridges for MIM capacitors, thick gold metallization for high Q inductors, and through-wafer vi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc1035208490e82f0a620d4fd2ea3ace
https://doi.org/10.1109/mwsym.2007.380339
https://doi.org/10.1109/mwsym.2007.380339
Autor:
Shun-Meen Kuo, Lih-Tyng Hwang
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
In conventional TRL (thru-reflection-line) de-embedding technique, a test fixturing, which mimics the traces (called adaptor) leading to a DUT (device under test), is fabricated. The TRL de-embedding procedure is performed on the test fixturing to ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08db1067b0753f65b46d1b36a41d252d
https://doi.org/10.1109/ectc.2007.374055
https://doi.org/10.1109/ectc.2007.374055
Publikováno v:
Digest of Papers. 2005 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2005..
Compact harmonic low and high band filters for RF front-end transmit modules using an IPD technology are demonstrated. These filters exhibit excellent performance with insertion loss below 0.5 dB and harmonic rejection close to or greater than 20 dB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b409eb579a9a557246ba406a6676b8db
https://doi.org/10.1109/smic.2005.1587990
https://doi.org/10.1109/smic.2005.1587990
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
An integrated passive device (IPD) technology has been developed to meet the ever increasing needs of size and cost reduction in radio front-end transceiver module applications. Electromagnetic (EM) simulation was used extensively in the design of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::823f51a3d94b77f87427580ee05c2989
https://doi.org/10.1109/ectc.2005.1441355
https://doi.org/10.1109/ectc.2005.1441355
Publikováno v:
Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).
It is essential to understand the impact of packaging on chips with copper/low k structures. In this paper, a multi-level, multi-scale modeling technique is used to study the die attach process. Four-level models are built to analyze the packaging im
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::002e7e83df0bc7abc55c8579f546bbe8
https://doi.org/10.1109/iitc.2002.1014907
https://doi.org/10.1109/iitc.2002.1014907
Publikováno v:
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
An RF switch made using MEMS (Micro Electro-Mechanical System) technology shows attractive electrical characteristics that are critically needed in the next generation low power consumption, high data rate RF wireless systems. In order to provide env
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abd99dc12a51946d71b7d4e4007ecdd8
https://doi.org/10.1109/ectc.2002.1008229
https://doi.org/10.1109/ectc.2002.1008229