Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Shu Yoshida"'
Autor:
Katsutoshi Ihara, Masashi Okaniwa, Kohei Higashiguchi, Takahito Sekido, Tsuyoshi Kida, Shu Yoshida
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:11-17
Internet of Things (IoT) accelerated by the rapid progress of 5G is bringing a lot of challenges to semiconductor packaging technologies. In particular, flip-chip bonding technology is strongly required to realize ultrafine-pitch products, such as ne
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d92e65ebd8c7f1f4a7d4c006875ddea
https://doi.org/10.1109/tcpmt.2019.2950697
https://doi.org/10.1109/tcpmt.2019.2950697
Autor:
Tsuyoshi Kida, Katsuhiko Shimura, Shu Yoshida, Suzuki Takuya, Seiji Shika, Katagiri Shunsuke, Kumazawa Yune
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
2.1D package is expected to lead the progresses of technology drivers such as 5G communications and AI (Artificial Intelligence), however, the organic interposers for 2.1D still have technological challenges in fine patterning. In this work, the nove
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3906dfc11b019c584f72c56d01a39c21
https://doi.org/10.1109/ectc32862.2020.00149
https://doi.org/10.1109/ectc32862.2020.00149
Autor:
Yoshimasa Hirashima, Shu Yoshida, Tsutomu Omatsu, Daisuke Okada, Shoichiro Fujisono, Tetsuya Mizutani, Makoto Nagai, Shoichi Shibata
Publikováno v:
Archives of Virology. 163:2805-2810
While neurotropic bovine astroviruses (BoAstVs) have been identified in North America and Europe, their presence has never been reported in Asia. In this study, we detected BoAstV in the brain of a steer showing neurological signs. Phylogenetic analy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::801c26dcdffd345d70b6c0b231fa773b
https://doi.org/10.1007/s00705-018-3898-3
https://doi.org/10.1007/s00705-018-3898-3
Publikováno v:
The Journal of Veterinary Medical Science
A survey of beak morphological abnormalities was performed on 6,201 chickens (egg-laying hens and chickens for meat production belonging to 25 flocks) brought to a poultry processing plant. The observed abnormalities varied among flocks with occurren
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2706a5859d4cf03689e94cadde91c0d2
http://europepmc.org/articles/PMC5627314
http://europepmc.org/articles/PMC5627314
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Photo-sensitive dielectric materials applicable to advanced organic interposers are desired to realize cost-effective semiconductor packages equipped with fine patterning capability. In this work, the novel photo-polymerizable compound expected to be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7ee583ce07074a713b2c0cb2dfa2dfbc
https://doi.org/10.1109/ectc.2019.00158
https://doi.org/10.1109/ectc.2019.00158
Autor:
Kohei Higashiguchi, Katsutoshi Ihara, Tsuyoshi Kida, Takahito Sekido, Shu Yoshida, Masashi Okaniwa, Takenori Takiguchi, Toyoji Oshima
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
TCB (Thermal Compression Bonding) process with NCF (Non Conductive Film) is expected as an effective solution for fine pitch applications brought by the progress of IoT (Internet of Things), however the production volume is limited to small level bec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0041486157426a30651751f9849ab18e
https://doi.org/10.1109/estc.2018.8546397
https://doi.org/10.1109/estc.2018.8546397
Autor:
Mika Suzuki, Shu Yoshida, Toyoji Oshima, Sotaro Hiramatsu, Kentarou Takano, Takashi Kobayashi, Yoshitaka Ueno, Takaki Tsuchida, Masahiko Shigaki, Tsuyoshi Kida
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Electronic materials capable of high speed transmission with ultra-low-loss are strongly desired in the semiconductor market. So novel BT (Bis-Maleimide Triazine) material dedicating to latest high speed applications has been developed. In this work,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb03adbbc99214cf4e4b0b293d32fa67
https://doi.org/10.1109/ectc.2018.00011
https://doi.org/10.1109/ectc.2018.00011
Autor:
Takeshi Obi, Hiroaki Kanouchi, Masato Kamata, Shu Yoshida, Konosuke Otomaru, Hiroaki Mitani, Akira Ohtsuka
Publikováno v:
Bioscience, biotechnology, and biochemistry. 81(11)
Egg productivity is declined by stress. It has been reported that some food supplements can improve the egg productivity due to a reduction of environmental stress. We evaluated the effect of fermented waste mushroom bed (FWMB) as a dietary additive
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c4b783ba738dada5de54ae4c64a8f9c4
https://pubmed.ncbi.nlm.nih.gov/29144889
https://pubmed.ncbi.nlm.nih.gov/29144889
Autor:
Tsuyoshi Kida, Kohei Higashiguchi, Shu Yoshida, Toyoji Oshima, Takenori Takiguchi, Masashi Okaniwa, Katsutoshi Ihara
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
This study investigated the relations between base resins and flux compounds applied to NCF (Non Conductive film) for thermal compression bonding with micro Cu pillar bumps. As the use of NCF expands, outgas during flip-chip bonding process is being
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17e51ae63191e2e8ed543d0fd2719247
https://doi.org/10.1109/ectc.2017.126
https://doi.org/10.1109/ectc.2017.126
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 79:2312-2323
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca317891acfc6c050d6aaec3187be036
https://doi.org/10.1299/kikaib.79.2312
https://doi.org/10.1299/kikaib.79.2312