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pro vyhledávání: '"Shu Chuen Ho"'
Publikováno v:
Thin Solid Films. :459-464
Exposed-die type packaging requires molding process capability to provide mold flash free situation. Presently, the trend is in adopting transfer molding to encapsulate the silicon device with epoxy molding compound, which involves high transfer pres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66157e24cfd6ba2a6bbe980affb55da2
https://doi.org/10.1016/j.tsf.2004.05.115
https://doi.org/10.1016/j.tsf.2004.05.115
