Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Shoulung Chen"'
Publikováno v:
Journal of the Chinese Institute of Engineers. 28:859-866
The strength distribution of semiconductor chips on a wafer was studied for this paper using the three‐point bending test method that complies with ASTM standard E855. It was found from thousands of testing results that a weak region in a wafer alw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ffac90544e2c87002799db8225ab05d
https://doi.org/10.1080/02533839.2005.9671056
https://doi.org/10.1080/02533839.2005.9671056
Autor:
Hon Lung Cheung, Wei Ma, Chen-Jung Tsai, Yick Chuen Chan, Francis Chee-Shuen Lee, Shoulung Chen, Ho-Yin Chan, Congshun Wang, Chun Cheong Wong
Publikováno v:
NEMS
The design, fabrication and characterization of an electrostatic-type bi-axial MEMS scanning mirror operating with inter-digitated comb fingers are presented. The effect of comb offset on device actuation is examined. In addition to standard designs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86e9fc19829e2102ea95a1d566971479
https://doi.org/10.1109/nems.2010.5592180
https://doi.org/10.1109/nems.2010.5592180
Publikováno v:
Micro-and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging ISBN: 9780387279749
Concern on stresses in solder bumps/underfill and warpage of flip chip BGA packages increases recently because reliability of flip chip packages relates directly to the corresponding stresses and warpage. In addition, when die size increases, the pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6da6f64f18297b2d377c317b80ebaa9f
https://doi.org/10.1007/0-387-32989-7_44
https://doi.org/10.1007/0-387-32989-7_44
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2c19e1719baac8cd4f8ad28086a0718
https://doi.org/10.1109/ectc.2005.1442017
https://doi.org/10.1109/ectc.2005.1442017
Publikováno v:
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
Die cracking is an annoying problem in the packaging industry. In our previous study, we have identified the weak region of the chip strength distribution in a wafer using the three-point bending test. It was found that the strength of the chips with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e58f90982ed366b4e7d44778fecbc11
https://doi.org/10.1109/itherm.2004.1318292
https://doi.org/10.1109/itherm.2004.1318292
Publikováno v:
IEEE Transactions on Advanced Packaging. Feb2006, Vol. 29 Issue 1, p149-157. 9p.
Autor:
Yick Chuen Chan, Chun Cheong Wong, Congshun Wang, Wei Ma, Ho-Yin Chan, Shoulung Chen, Hon Lung Cheung, Lee, F.C.S., Chen-Jung Tsai
Publikováno v:
2010 5th IEEE International Conference on Nano/Micro Engineered & Molecular Systems (NEMS); 2010, p186-190, 5p
Autor:
Yu-Hua Chen, Jyh-Rong Lin, Shoulung Chen, Cheng-Ta Ko, Tzu-Ying Kuo, Chien-wei Chien, Shan-Pu Yu, Ostmann, A., Neumann, A.
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971); 2004, p595-599, 5p
Publikováno v:
56th Electronic Components & Technology Conference 2006; 2006, p8-8, 1p
Publikováno v:
Proceedings Electronic Components & Technology, 2005. ECTC '05; 2005, p1677-1677, 1p