Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Shou-Lung Chen"'
Autor:
Kuo-Bin Hong, Wei-Ta Huang, Hsin-Chan Chung, Guan-Hao Chang, Dong Yang, Zhi-Kuang Lu, Shou-Lung Chen, Hao-Chung Kuo
Publikováno v:
Crystals, Vol 11, Iss 10, p 1237 (2021)
In this paper, we demonstrate the design and fabrication of a high-power, high-speed flip-chip vertical cavity surface emitting laser (VCSEL) for light detection and ranging (LiDAR) systems. The optoelectronic characteristics and modulation speeds of
Externí odkaz:
https://doaj.org/article/92ec2d9996cb4c3f811a27ac76cbd451
Autor:
Shou-lung Chen, 陳守隆
100
The coaches of elementary school sports teams are concurrently teachers. In so doing, teachers suffer the problem of coordinating between different roles. Training and supervising sports teams is a demanding job which requires supports from
The coaches of elementary school sports teams are concurrently teachers. In so doing, teachers suffer the problem of coordinating between different roles. Training and supervising sports teams is a demanding job which requires supports from
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/77102065568956990800
Autor:
Dong Yang, Kuo-Bin Hong, Wei-Ta Huang, Hsin-Chan Chung, Zhi-Kuang Lu, Shou-Lung Chen, Hao-Chung Kuo, Guan-Hao Chang
Publikováno v:
Crystals, Vol 11, Iss 1237, p 1237 (2021)
Crystals
Volume 11
Issue 10
Crystals
Volume 11
Issue 10
In this paper, we demonstrate the design and fabrication of a high-power, high-speed flip-chip vertical cavity surface emitting laser (VCSEL) for light detection and ranging (LiDAR) systems. The optoelectronic characteristics and modulation speeds of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8200d48ac267e33d1b18c7e863a04b09
https://doi.org/10.3390/cryst11101237
https://doi.org/10.3390/cryst11101237
Autor:
Shang-Hung Shen, Shou-Lung Chen, Chih-Li Chen, Pei-Jer Tzeng, Yi-Feng Hsu, Chun-Te Lin, Tzu-Kun Ku, Yu-Chen Hsin, Ming-Jer Kao, John H. Lau, Chun-Kun Wu, Jui-Chin Chen, Sue-Chen Liao, Chi-Hon Ho
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
In this study, the optimization of Cu CMP performance (dishing) for removing thick Cu plating overburden due to Cu plating for deep TSVs in a 300mm wafer is investigated. Also, backside isolation oxide CMP for TSV Cu exposure is discussed. In order t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4251a625f7459b379bea57f3a951546
https://doi.org/10.1109/ectc.2011.5898693
https://doi.org/10.1109/ectc.2011.5898693
Publikováno v:
56th Electronic Components and Technology Conference 2006.
As the demands for high-density, high-speed, high-performance, and multi-function in portable electronic products, packaging technologies require significant improvement to bring out ICs' performance and shrink the total module or package size. One r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3b352d25f41dd3bcdaaa04d3b1985c8
https://doi.org/10.1109/ectc.2006.1645666
https://doi.org/10.1109/ectc.2006.1645666
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
For several kinds of advanced applications, such as RFID, telecommunication, portable electronics, or wearable electronics, the need of packaged semiconductor chip thick is getting thinner drastically. One representative technology is to embed an act
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f8b96da4426c4d806c1e513802959ab
https://doi.org/10.1109/ectc.2005.1441990
https://doi.org/10.1109/ectc.2005.1441990
Autor:
Tzu-Ying Kuo, Yu-Hua Chen, Jyh-Rong Lin, A. Neumann, Shou-Lung Chen, A. Ostmann, Cheng-Ta Ko, Chien-Wei Chien, Shan-Pu Yu
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
The structure of chip-in-substrate package, CiSP, is shown. The thin chips (50mum) are bonded on the organic substrate (BT) flatly. Subsequently, the chips are covered among the build-up dielectric layer, which can be either a RCC (resin coated coppe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ee328116d8ec9904a644d7a4a2cf708
https://doi.org/10.1109/eptc.2004.1396677
https://doi.org/10.1109/eptc.2004.1396677