Zobrazeno 1 - 10
of 63
pro vyhledávání: '"Shoji Mimotogi"'
Autor:
Kinji Kimura, Taiki Kimura, Masami Takata, Shoji Mimotogi, Hiroki Tanaka, Yoshimasa Nakamura, Tetsuaki Matsunawa
Publikováno v:
Advances in Parallel & Distributed Processing, and Applications ISBN: 9783030699833
In semiconductor manufacturing process, lithography simulation modeling is known as an ill-posed problem. A normal solution of the problem is generally insignificant due to measurement constraints. In order to alleviate the difficulty, we introduced
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f3a9fbe761e5bd3249f572070511c3f
https://doi.org/10.1007/978-3-030-69984-0_50
https://doi.org/10.1007/978-3-030-69984-0_50
Publikováno v:
Optical Microlithography XXXIII.
Lithography simulation is an essential technique for today's semiconductor manufacturing process. Although several rigorous models have been proposed, these methods are time-consuming. In order to calculate a full chip in realistic time, a fast and a
Publikováno v:
Japanese Journal of Applied Physics. 45:5391-5395
In the 45 nm half pitch node, a mask induced polarization effect appears. Because of this effect, intensity of diffracted light depends on a pattern size and a diffraction order. This is pronounced in an attenuated phase shift mask (attPSM). A mask t
Autor:
Yasuyuki Taniguchi, Satoshi Tanaka, Junko Abe, Hiroko Nakamura, Kazuya Sato, Shoji Mimotogi, Soichi Inoue
Publikováno v:
Japanese Journal of Applied Physics. 45:5409-5417
The double line and space (L&S) formation method was proved to have the capability to form contact hole (C/H) patterns with high resolution and wide process windows. The drawback of the method is its high cost. By replacing two L&S masks by one C/H m
Publikováno v:
SPIE Proceedings.
In progress of lithography technologies, the importance of Mask3D analysis has been emphasized because the influence of mask topography effects is not avoidable to be increased explosively. An electromagnetic filed simulation method, such as FDTD, RC
The prospects of design for roll to roll lithography: layout refinement utilizing process simulation
Autor:
Yohko Furutono, Ryoichi Inanami, Satoshi Tanaka, Mitsuko Shimizu, Masayuki Hatano, Shoji Mimotogi, Sachiko Kobayashi, Kazuto Matsuki
Publikováno v:
SPIE Proceedings.
Directed self-assembly (DSA) of block copolymers (BCPs) is a promising method for producing the sub-20nm features required for future semiconductor device scaling, but many questions still surround the issue of defect levels in DSA processes. Knowled
Autor:
Masanori Takahashi, Y. Kawabata, M. Motokubota, Shigeki Nojima, Simon Maeda, Shoji Mimotogi, Satoshi Tanaka, Katsuyoshi Kodera
Publikováno v:
SPIE Proceedings.
Mask-induced aberration, which causes the deterioration of pattern fidelity owing to the phase difference between the diffraction orders in sub-wavelength lithography conditions, is an intricate problem. To evaluate the extent of the effect computati
Autor:
Toshiya Kotani, Fumiharu Nakajima, Shoji Mimotogi, Chikaaki Kodama, Shinji Miyamoto, Shigeki Nojima, Hirotaka Ichikawa, Koichi Nakayama
Publikováno v:
SPIE Proceedings.
In this paper, we propose a new flexible routing method for Self-Aligned Double Patterning (SADP). SADP is one of the most promising candidates for patterning sub-20 nm node advanced technology but wafer images must satisfy tighter constraints than l
Autor:
Shoji Mimotogi
Publikováno v:
SPIE Proceedings.
Patterning methods for sub-10nm half pitch are discussed. Four patterning methods are selected due to discussing their feasibility: immersion lithography with self-aligned octuplet patterning (Imm-SAOP), EUVL with self-aligned double patterning (EUV-
Autor:
Shoji Mimotogi, Toshiya Kotani, Chikaaki Kodama, Atsushi Takahashi, Shigeki Nojima, Koichi Nakayama, Hirotaka Ichikawa, Shinji Miyamoto
Publikováno v:
ASP-DAC
Although Self-Aligned Double and Quadruple Patterning (SADP, SAQP) have become the most promising processes for sub-20 nm and sub-14 nm node advanced technologies, not all wafer images are realized by them. In advanced technologies, feasible wafer im