Výsledky vyhledávání - "Shoichi Kodama"

Development of global human resources in Singapore school education

Autor: Kiho, Tanaka, Shoichi, Kodama, Noritsugu, Okita, Tadashi, Ohashi

Publikováno v: 同志社大学教職課程年報 = The annual bulletin of the Teacher-Training Course at Doshisha University. 8:48-60

資源の乏しいシンガポールは、"人"を最大の資源と考え、経済競争力を高めるために、能力主義をベースとした教育システムによって、国家レベルでのグローバルな人材育成やそれに伴�

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=jairo_______::88e6595a00fbdf55e3101a4316b8327e
http://id.nii.ac.jp/1707/00026391/

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Development of Resins for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration

Autor: Kim Young Suk, Shinji Maetani, Shoichi Kodama, Naoko Araki, Takayuki Ohba

Publikováno v: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

We have developed permanent and temporary adhesives that are suitable for fabricating multilevel stacks using ultra-thin wafers of several micrometers or less for wafer-on-wafer (WOW) technology with bumpless dual-damascene interconnects (via-last af

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::68d4bf865c2d8e2bafd419c248de27f9
https://doi.org/10.1109/ectc.2019.00157

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Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation

Autor: Young Suk Kim, Guan Wei Chen, Takayuki Ohba, Yi-Lun Yang, Kyosuke Kobinata, Hiroyuki Ito, Jia-Ling Liu, Kuan-Neng Chen, Shoichi Kodama

Publikováno v: 2019 International Conference on Electronics Packaging (ICEP).

In this study, a sandwich structure (silicon/polymer/silicon) was prepared to demonstrate the adhesion strength between polymer and silicon layers using a four-point bending system. For the first time, the stealth dicing (SD) method was applied to th

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::cb8223a5f5888a4cf5633591ca6ecd11
https://doi.org/10.23919/icep.2019.8733422

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New Adhesive Design and Evaluation for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration

Autor: Shoichi Kodama, Shinji Maetani, Takayuki Ohba, Young Suk Kim, Naoko Araki

Publikováno v: 2019 International Conference on Electronics Packaging (ICEP).

The material viscosities of permanent and temporary adhesives were examined using the rigid body pendulum method to reveal a suitable for the wafer bonding process at 100 °C. Properties suited for the debonding process The adhesive is applied to waf

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1e89838f00ea72e2683d7c5a3f6b7ec9
https://doi.org/10.23919/icep.2019.8733438

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Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics

Autor: Shoichi Kodama, Tomoji Nakamura, Young Suk Kim, Koji Fujimoto, Nobuhide Maeda, Y. Mizushima, Akihito Kawai, Takayuki Ohba

Publikováno v: Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1471-1476

An ultra-thinning down to 2.6-um using 300-mm 2Gb DRAM wafer has been developed. Effects of Si thickness and Cu contamination at wafer backside in terms of DRAM yield and retention characteristics are described. Total thickness variation (TTV) after

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bf3c965a9c18df0ce99eb77bdaa26b83
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100738574

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The traits educators need and the image of an ideal teacher : a research project conducted at the Doshisha University and Kyoto University of Education’s graduate teacher training program

Autor: Shoichi, Kodama

Publikováno v: 同志社大学教職課程年報 = The annual bulletin of the Teacher-Training Course at Doshisha University. 5:76-88

実践論文(Practice-Based Article)

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=jairo_______::51a0bf486dcb5c1a1064954465757b96
http://id.nii.ac.jp/1707/00023585/

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Development of Micrometer-Thick Bonding Material for Wafer-On-Wafer (WOW) Applications

Autor: Chun-Chuan Lin, Takayuki Ohba, Hsiang-Hung Chang, Naoko Araki, Young Suk Kim, Shoichi Kodama, Chieh-Ling Hsiao

Publikováno v: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

We have developed permanent and temporary adhesives that are suitable for fabricating multilevel stacks using ultra-thin wafers of several micrometers or less [1]. In this paper, we describe a hot-melt type temporary adhesive layer with a thickness o

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5e3e10975275c057f9581d9c995b59b2
https://doi.org/10.1109/impact.2018.8625843

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Optimization of Via Bottom Cleaning for Bumpless Interconnects and Wafer-on-Wafer (WOW) Integration

Autor: Takayuki Ohba, Shoichi Kodama, Chieh-Ling Hsiao, Young Suk Kim, Naoko Araki, Cha-Hsin Lin, Hsiang-Hung Chang, Y. Mizushima

Publikováno v: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Effect of via bottom cleaning process and electrical characteristics of through-silicon via (TSV) are investigated using 300-mm wafer-on-wafer (WOW) process. Several kinds of cleaning method including wet and dry process were employed after TSV and S

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::97032a84ecd6c83fc92fe691bb258f67
https://doi.org/10.1109/ectc.2018.00295

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