Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Shoichi, Suenaga"'
Publikováno v:
iScience, Vol 27, Iss 2, Pp 108893- (2024)
Summary: α-Synuclein and LRRK2 are associated with both familial and sporadic Parkinson’s disease (PD), although the mechanistic link between these two proteins has remained elusive. Treating cells with lysosomotropic drugs causes the recruitment
Externí odkaz:
https://doaj.org/article/2dc29bb247bc4fb6b0e29398efefee35
Autor:
Shoichi, Suenaga
Publikováno v:
淑徳大学研究紀要. 総合福祉学部・コミュニティ政策学部 = Shukutoku University bulletin. College of Integrated Human and Social Welfare Studies, College of Community Studies. 55:87-100
幼児の成長にとって，自然体験は欠くことのできないものである。特に飼育の体験は，幼児が生物の命に主体的にかかわっていく体験として重要である。一方飼育には，生物に関わるた
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=jairo_______::9c7d8665ffa5f336d9e9ee73e8b02196
http://id.nii.ac.jp/1544/00001932/
http://id.nii.ac.jp/1544/00001932/
Autor:
Miki Umetani, Takashi Nozoe, Yuichi Wakamoto, Edo Kussell, Miho Fujisawa, Hidenori Nakaoka, Shoichi Suenaga, Reiko Okura
Bacterial persistence is a phenomenon in which a small fraction of isogenic bacterial cells survives a lethal dose of antibiotics. It is generally assumed that persistence is caused by growth-arrested dormant cells generated prior to drug exposure. H
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ed7bba71bf2c0e71e4fd4bfc1ebffcf
https://doi.org/10.1101/2021.10.28.466227
https://doi.org/10.1101/2021.10.28.466227
Autor:
Jianghua Chen, Stuart McDonald, Qinfen Gu, Kazuhiro Nogita, Shoichi Suenaga, Yong Zhang, Guang Zeng
Publikováno v:
Intermetallics. 43:85-98
Cu6Sn5 is a critical intermetallic compound in future three-dimensional integrated circuit (3D IC) in micro-electronic packaging and has different crystal structures in the solid state. This paper investigates the effect of Zn, Au and In on the phase
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d58528e3dcdf794b6a65e4c1b85c4f27
https://doi.org/10.1016/j.intermet.2013.07.012
https://doi.org/10.1016/j.intermet.2013.07.012
Autor:
Shoichi Suenaga, Guang Zeng, Stuart McDonald, Qinfen Gu, Christopher M. Gourlay, J. Read, Kazuhiro Nogita
Publikováno v:
Philosophical Magazine. 93:3627-3647
The transformation kinetics of βSn (white tin) to and from αSn (grey tin) are studied by synchrotron X-ray diffraction of seeded powder samples of 99.99% Sn. An analysis of thermal expansion behaviour revealed that the volume change of transformati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::418ec7088c69c03d7455f1d50c667846
https://doi.org/10.1080/14786435.2013.820381
https://doi.org/10.1080/14786435.2013.820381
Autor:
Shoichi Suenaga, Keith Sweatman, Stuart McDonald, Tetsuro Nishimura, Hideaki Tsukamoto, Kazuhiro Nogita
Publikováno v:
Microelectronics Reliability. 51:657-667
This study aims to investigate the shear and tensile impact strength of solder ball attachments. Tests were conducted on Ni-doped and non-Ni-doped Sn–0.7wt.% Cu, Sn–37wt.% Pb and Sn–3.0wt.% Ag–0.7wt.% Cu solder ball grid arrays (BGAs) placed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cfe1c2679e0be07bc0db7df438c8d5a
https://doi.org/10.1016/j.microrel.2010.10.012
https://doi.org/10.1016/j.microrel.2010.10.012
Publikováno v:
Materials Science and Engineering: B. 171:162-171
This study aims to investigate the shear and tensile impact behavior of ball grid arrays (BGAs) placed on Ni (P)/Au surface-finished substrates considering the microstructure and compositions of intermetallic compounds (IMCs) formed at the solder/sub
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a3f9d7356e1dfff876c184f5281c8aa
https://doi.org/10.1016/j.mseb.2010.03.092
https://doi.org/10.1016/j.mseb.2010.03.092
Autor:
Akihisa Takeuchi, Kazuhiro Nogita, Christopher M. Gourlay, Hideyuki Yasuda, Stuart McDonald, Yoshio Suzuki, Hideaki Tsukamoto, Kentaro Uesugi, Shoichi Suenaga
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 3:40-46
Trace elements are increasingly being incorporated into lead-free solder compositions. This paper analyses the distribution of trace elements in solder joints when commercial purity Sn-based alloys are soldered onto Cu substrates. Analysis techniques
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff92a59fbf20a4695303c477b8600135
https://doi.org/10.5104/jiepeng.3.40
https://doi.org/10.5104/jiepeng.3.40
Autor:
Kazuhiro Nogita, Hideaki Tsukamoto, Shoichi Suenaga, Stuart McDonald, Tetsuro Nishimura, J. Read
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 2:46-54
The authors found inhibition of cracking in the interfacial Cu6Sn5 intermetallic when Ni containing Sn–0.7Cu alloy was used for soldering. It is thought that this crack inhibition occurred due to the stabilisation of the high temperature hexagonal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d7b1bc6e443c6391ca55c70c039cd469
https://doi.org/10.5104/jiepeng.2.46
https://doi.org/10.5104/jiepeng.2.46
Autor:
J. Read, Christopher M. Gourlay, Tetsuro Nishimura, Arne K. Dahle, Kazuhiro Nogita, Shoichi Suenaga
Publikováno v:
MATERIALS TRANSACTIONS. 49:443-448
Phosphorus is often added to wave-solder baths as an anti-oxidation agent. Despite this practice, there is little information on how phosphorus influences the solidification and flow properties of new lead-free solders such as Sn-0.7Cu-0.05Ni. This p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b28dd69d250400741597e34ca94e1b24
https://doi.org/10.2320/matertrans.mbw200713
https://doi.org/10.2320/matertrans.mbw200713