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The power law creep behaviour of the Sn–45Pb–2Sb peritectic solder alloy was investigated using an impression test apparatus. The tests were carried out under constant stress in the range 15 to 40 MPa and at temperatures in the range 290 to 360 K
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=57a035e5b1ae::998db81737b34f9c7ece9f8dccb6448f
https://www.bib.irb.hr/585561
https://www.bib.irb.hr/585561
