Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Shiu Ko Jang Jian"'
Publikováno v:
AIP Advances, Vol 2, Iss 4, Pp 042164-042164-8 (2012)
Thin thermal oxide film (∼36 nm) was grown on p--Si (100) wafers in a vertical furnace at 950 °C for 90 min in 1 atm dry O2 as a vehicle for monitoring metal contamination. They are annealed in separate vertical furnaces at 1100°C for 120 min in
Externí odkaz:
https://doaj.org/article/a967548ae4a24afa8ca7c09675ad7b1b
Autor:
Min-Hao Hong, Chun-Wei Chang, Dung-Ching Perng, Kuan-Ching Lee, Shiu-Ko Jang Jian, Wei-Fan Lee, Yen Chuang, Yu-Ta Fan, Woo Sik Yoo
Publikováno v:
AIP Advances, Vol 2, Iss 3, Pp 032150-032150-10 (2012)
B-doped, thin Si1-xGex bi-layers with different Ge content and B concentrations were epitaxially grown on Si(100) device wafers. Diffusion behavior of Ge and B atoms during rapid thermal annealing were monitored by multiwavelength micro-Raman spectro
Externí odkaz:
https://doaj.org/article/d5c3a98906c945a1aa0ea730ca976625
Autor:
Chun-Wei Chang, Min-Hao Hong, Wei-Fan Lee, Kuan-Ching Lee, Shiu-Ko Jang Jian, Yen Chuang, Yu-Ta Fan, Noriyuki Hasuike, Hiroshi Harima, Takeshi Ueda, Toshikazu Ishigaki, Kitaek Kang, Woo Sik Yoo
Publikováno v:
AIP Advances, Vol 2, Iss 1, Pp 012124-012124-8 (2012)
Non-contact monitoring of Ge content and B concentration in single and double Si1-xGex epitaxial layers on Si(100) device wafers was attempted using high-resolution, multiwavelength micro-Raman spectroscopy. The Ge content and B concentration determi
Externí odkaz:
https://doaj.org/article/212d8a7e9b6b420f87ff8e4bd282227e
Autor:
Chih-Mu Huang, Ting-Chun Wang, Woo Sik Yoo, Ying-Lang Wang, Chih-Cherng Jeng, Shiu-Ko Jang Jian
Publikováno v:
Journal of Materials Research. 28:1269-1277
The quality of interface between ultrathin silicon dioxide films and their silicon (Si) wafers was characterized using room-temperature photoluminescence (RTPL) and Raman spectroscopy. Three types of low-temperature (350 °C or room temperature) oxid
Autor:
Chih-Mu Huang, Ying-Lang Wang, Ting-Chun Wang, Shiu-Ko Jang Jian, Woo Sik Yoo, Chih-Cherng Jeng
Publikováno v:
ECS Transactions. 53:167-176
Plasma processes have been widely used in the manufacturing of semiconductor devices. Etching of polysilicon, dielectric and metal films, dielectric deposition, cleaning, sputtering, photoresist stripping and ion implantation commonly use plasma assi
Autor:
Shiu-Ko Jang Jian, Ying-Lang Wang, Chih-Cherng Jeng, Ting-Chun Wang, Chih-Mu Huang, Woo Sik Yoo
Publikováno v:
ECS Journal of Solid State Science and Technology. 2:P214-P224
Publikováno v:
ECS Journal of Solid State Science and Technology. 1:P297-P302
Room temperature photoluminescence (RTPL) and ultraviolet (UV) Raman spectra from p−-Si wafers and low-energy, low-dose boron (B) implanted n−-Si wafers, annealed under various laser power densities, were measured. The RTPL intensity from implant
Publikováno v:
ECS Solid State Letters. 1:P76-P78
Autor:
Hiroshi Harima, Ying-Lang Wang, Chih-Mu Huang, Ting-Chun Wang, Shiu-Ko Jang Jian, Woo Sik Yoo, Noriyuki Hasuike, Chih-Cherng Jeng, Hiroshi Nishigaki
Publikováno v:
2013 13th International Workshop on Junction Technology (IWJT).
Plasma processes have long been used in various stages of semiconductor device fabrication. Plasma enhanced chemical vapor deposition (PECVD) has been widely used as a low temperature silicon dioxide film deposition method in the semiconductor indust
Publikováno v:
AIP Advances, Vol 2, Iss 4, Pp 042164-042164-8 (2012)
Thin thermal oxide film (∼36 nm) was grown on p--Si (100) wafers in a vertical furnace at 950 °C for 90 min in 1 atm dry O2 as a vehicle for monitoring metal contamination. They are annealed in separate vertical furnaces at 1100°C for 120 min in