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Publikováno v:
Japanese Journal of Applied Physics. 30:L632
The interaction of deposited Cu9Al4 intermetallic compound film with a silicon substrate is studied by Auger electron spectroscopy. Although the incorporation of silicon into the Cu9Al4 film with low concentration level is observed, the interface is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::240a36fa59be13b7dd0280f5056122ca
https://doi.org/10.1143/jjap.30.l632
https://doi.org/10.1143/jjap.30.l632
Autor:
Noya, Atsushi, Sasaki, Katsutaka, Shirou Ohtaka, Shirou Ohtaka, Nobuyuki Sasao, Nobuyuki Sasao
Publikováno v:
Japanese Journal of Applied Physics; April 1991, Vol. 30 Issue: 4 pL632-L632, 1p