Zobrazeno 1 - 10
of 67
pro vyhledávání: '"Shirakawa, Michihiro"'
Publikováno v:
In Tetrahedron 2006 62(9):2016-2024
Autor:
Goto Akiyoshi, Tango Naohiro, Ryo Nishio, Hidenori Takahashi, Shirakawa Michihiro, Toru Fujimori, Marumo Kazuhiro, Mitsuhiro Fujita, Kei Yamamoto
Publikováno v:
Journal of Photopolymer Science and Technology. 30:367-372
Publikováno v:
Journal of Photopolymer Science and Technology. 29:75-80
Autor:
Hironori Oka, Tadashi Omatsu, Furutani Hajime, Mitsuhiro Fujita, Shirakawa Michihiro, Toru Fujimori, Sakita Kyohei, Toru Tsuchihashi, Nishiki Fujmaki, Wataru Nihashi
Publikováno v:
Advances in Patterning Materials and Processes XXXV.
For semiconductor device manufacturing, line width roughness (LWR) and defect reduction is one of the most important items to obtain high yield. In this study we described the development of novel high absorption resists for use in extreme ultra viol
Akademický článek
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Autor:
Wataru Nihashi, Paolo A. Gargini, Shirakawa Michihiro, Toru Fujimori, Toru Tsuchihashi, Toshiro Itani, Kurt G. Ronse, Patrick P. Naulleau, Furutani Hajime
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2017.
Extreme ultraviolet (EUV) lithography is considered to be the most effective strategy for realize 7 nm generation manufacturing and beyond. A key factor for the realization of EUV lithography is the choice of EUV resist material that is capable of re
Autor:
Wataru Nihashi, Hideaki Tsubaki, Marumo Kazuhiro, Tango Naohiro, Goto Akiyoshi, Kei Yamamoto, Hidenori Takahashi, Furutani Hajime, Mitsuhiro Fujita, Shirakawa Michihiro
Publikováno v:
SPIE Proceedings.
The main challenge in ArF lithography is to reduce cost of ownership (CoO) because increase in multi-patterning process is generally required to obtain a fine pattern. As a consequence, industry strongly requires ArF lithography process with a fast s
Autor:
Weimin Gao, Thomas Mülders, Ulrich Klostermann, Masahiro Yoshidome, Sou Kamimura, Hironobu Taoka, Grozdan Grozev, Shirakawa Michihiro, Waikin Li, Bernd Küchler
Publikováno v:
SPIE Proceedings.
Simulation of negative tone development (NTD) resist has become a challenge for physical resist modeling. Traditionally, resist modeling was mainly limited to reaction-diffusion models for post exposure bake (PEB) and standard development rate models
Autor:
Ou Keiyu, Nanae Muraki, Takashi Yakushiji, Asakawa Daisuke, Naoya Hatakeyama, Mitsuhiro Fujita, Yasunori Yoneyama, Tadashi Omatsu, Shirakawa Michihiro, Toru Fujimori
Publikováno v:
2016 International Symposium on Semiconductor Manufacturing (ISSM).
Negative tone imaging (NTI) is a method for obtaining a negative-tone reversal pattern by developing with an organic solvent. As NTI process can break-through the resolution limit of a conventional positive-tone development (PTD) process, it has been
Akademický článek
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