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pro vyhledávání: '"Shinya Kawakita"'
Autor:
Shinya Kawakita
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 23:209-211
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In recent years, the heat generation value inside ECU has been increasing. So, thermal management is important to maintain the normal ECU operation. One of the means to improve the heat dissipation of ECU is to increase the thermal conductivity of TI
Publikováno v:
The Proceedings of the Thermal Engineering Conference. 2019:0027
Publikováno v:
Journal of Magnetism and Magnetic Materials. 155:172-175
The correlation between the cleanness of the substrate surface and magnetic properties is discussed for thin-film media fabricated using an ultraclean (UC) sputtering process. Only slight dry-etching of the substrate surface (etched depth about a few
Publikováno v:
Journal of Magnetism and Magnetic Materials. 155:238-241
Magnetic properties, microstructure and their effect on media noise in Co 85.5 Cr 10.5 Ta 4 and Co 62.5 Ni 30 Cr 7.5 thin-film media fabricated using an ultraclean (UC) sputtering process are discussed as a function of the thickness of the Cr underla
Publikováno v:
2012 2nd IEEE CPMT Symposium Japan.
When using a thermal sheet for cooling, heat-generating components are pressed strongly against the thermal sheet to maximize the contact area and reduce the thermal sheet thickness. However, such pressure can reduce the reliability of the solder joi
Publikováno v:
The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec). 2015:2A1-P03_1
Autor:
Nobutaka Shimada, Shinya Kawakita
Publikováno v:
The Proceedings of JSME annual Conference on Robotics and Mechatronics (Robomec). 2015:2A1-P04_1
Autor:
Katsumasa Suzuki, Shinya Kawakita
Publikováno v:
The Proceedings of Yamanashi District Conference. 2005:201-202
Publikováno v:
Journal of Applied Physics. 79:5339
The media noise performance is discussed in connection with grain size and intergranular coupling for the Co85.5Cr10.5Ta4, Co78Cr17Ta5, and Co62.5Ni30Cr7.5 thin‐film media fabricated under the ultraclean sputtering process (UC process). It is clari