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pro vyhledávání: '"Shinya Hamagishi"'
Publikováno v:
Journal of Thermal Science and Technology, Vol 14, Iss 1, Pp JTST00013-JTST00013 (2019)
Information and communication technology (ICT) cooling devices increasingly need to be able to be installed in high-density packaged equipments, especially these exposed to high-temperature environments such as 1U-height servers and packet transport
Externí odkaz:
https://doaj.org/article/aebbb3cb63c64b569de6ea2ac67ace52
Publikováno v:
Journal of Thermal Science and Technology. 14:JTST00013-JTST00013