Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Shintarou Takahashi"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000729-000750
Glass for use as an Interposers with through vias (TGV) are emerging as the next generation substrates for die level and wafer level packaging substrates. This need is being driven increasing number of interconnects, desire to have a KGD (known good
Publikováno v:
Horticultural Research (Japan). 8:373-379
生食用ソラマメの食味品質に対しては,呈味成分として糖類および遊離アミノ酸が関与していると考えられるが,それらの登熟過程における詳細な量的変化ならびに食味との関係につい
Publikováno v:
Journal of The Japan Institute of Marine Engineering. 41:50-55
Maintenance and inspection work during operation for the low speed diesel engines have to be minimized to rationalize the work and reduce the maintenance cost. For higher reliability and automatic surveillance, the detection of abnormal conditions an