Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Shintaro Yabu"'
Publikováno v:
Insects, Vol 14, Iss 2, p 202 (2023)
Many lepidopteran larvae show body color polyphenism, and their colors may be cryptic on the host plant leaves. To elucidate the effect of the host plant color on the plastic larval body color, we focused on the lycaenid butterfly Zizeeria maha, whic
Externí odkaz:
https://doaj.org/article/0ac5152d0dca434badcb9095cf906f8f
Publikováno v:
International Symposium on Microelectronics. 2018:000153-000160
The uses of the semiconductor increase by the development of Internet of Things. Miniaturization of the semiconductor wiring to bring speedup, electric power saving advances, and various technologies are developed. The new technology that applied a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04ac07ca3969407becbf660f7e8a2cf1
https://doi.org/10.4071/2380-4505-2018.1.000153
https://doi.org/10.4071/2380-4505-2018.1.000153
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
The uses of the semiconductor increase by the development of Internet of Things. Miniaturization of the semiconductor wiring to bring speedup, electric power saving advances, and various technologies are developed. The new technology that applied a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::440fb38d13e626ca0649034d0d48b077
https://doi.org/10.23919/icep.2019.8733466
https://doi.org/10.23919/icep.2019.8733466
Autor:
Aiba Akira, Noritaka Takezoe, Hajime Kikuiri, Tomoyuki Habu, Kazuki Arikawa, Masaki Miura, Endo Shinichi, Hiroki Horibe, Hiroko Suzuki, Shintaro Yabu
Publikováno v:
International Symposium on Microelectronics. 2016:000478-000481
Lately, Semi Additive process has been considered to dry processing for the downsizing of the emiconductor packages. WET process is a process depending on the chemical reaction of the chemical solution. There are many problems with the formation of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7bf25a87ab5e5d6cbcb7bc681a908c6
https://doi.org/10.4071/isom-2016-tha44
https://doi.org/10.4071/isom-2016-tha44
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The uses of the semiconductor increase by the development of Internet of Things. Miniaturization of the semiconductor wiring to bring speedup, electric power saving advances, and various technologies are developed. The new technology that applied a s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e830324fb2d0c79d50ee4239c586c89
https://doi.org/10.1109/ectc.2018.00261
https://doi.org/10.1109/ectc.2018.00261
Autor:
Darmawikarta Kristof, Michael Obrien, Hiroki Horibe, Aiba Akira, Jain Rahul, Toru Fujinami, Namai Masahito, Hajime Kikuiri, Shintaro Yabu, Tomoyuki Habu, Hiroko Suzuki, Endo Shinichi, Maruyama Shun
Publikováno v:
International Symposium on Microelectronics. 2015:000465-000468
Smear residue from the build-up dielectric material is left at the bottom of the microvia after laser drill process which, if not cleaned, poses risk to the electrical functionality of the device. Thus, microvia cleanliness is the key to a reliable a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::414fb2937b21a3a753c6bff9aabb4aaa
https://doi.org/10.4071/isom-2015-wp46
https://doi.org/10.4071/isom-2015-wp46
Autor:
Masaki Miura, Endo Shinichi, Shintaro Yabu, Hajime Kikuiri, Hiroki Horibe, Hiroko Suzuki, Aiba Akira, Tomoyuki Habu
Publikováno v:
2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Semi Additive process is considered to dry processing for the miniaturization of the semiconductor packages. There are many problems in the manufacturing substrate of print circuit board, at the materials, tools, processes, conditions etc. Wet proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d414b9f05e8e2a2caf6408358aade83e
https://doi.org/10.1109/impact.2017.8255908
https://doi.org/10.1109/impact.2017.8255908
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 13:E19-013
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a985ec89518fe6c1735de0cebc92bba
https://doi.org/10.5104/jiepeng.13.e19-013-1
https://doi.org/10.5104/jiepeng.13.e19-013-1
Autor:
Naoki Kitano, Sanchali Bhattacharjee, Shintaro Yabu, Daniel N. Sobieski, Toru Fujinami, Ebrahim Andideh, Hiroki Horibe, Tomoyuki Habu, Eiji Ozawa, Kenichi Hirose
Publikováno v:
International Symposium on Microelectronics. 2013:000492-000495
The desmear process of removing via residue after laser drill in substrate manufacturing is a critical step for reliability and electrical performance. Cost effective and environmentally clean desmear processes are industry-wide objectives, as the cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0994c44a8db74ccb3e341a0833bcf4f
https://doi.org/10.4071/isom-2013-wa32
https://doi.org/10.4071/isom-2013-wa32
Autor:
Masaki Miura, Aiba Akira, Endo Shinichi, Noritaka Takezoe, Hajime Kikuiri, Shintaro Yabu, Namai Masahito, Hiroki Horibe, Hiroko Suzuki, Kazuki Arikawa, Tomoyuki Habu
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Recently, it is required that the high density interconnect substrates implemented to the electrically functional devices must be smaller and thinner because of therapid spread of IoT. Microelectronics assembly and packaging technology also require h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cec17285df916388ee96769c6a41c44d
https://doi.org/10.1109/ectc.2016.361
https://doi.org/10.1109/ectc.2016.361