Výsledky vyhledávání - "Shinobu Saitoh"

Via-Shape-Control for Copper Dual-Damascene Interconnects With Low-k Organic Film

Autor: Tatsuya Usami, K. Kinoshita, K. Shiba, Munehiro Tada, Shinobu Saitoh, Yoshihiro Hayashi, Takamaro Kikkawa, M. Tagami, Masayuki Hiroi, T. Onodera

Publikováno v: IEEE Transactions on Semiconductor Manufacturing. 21:256-262

Copper dual-damascene (DD) interconnects are fabricated with low-k organic film (SiLKtrade) without any etch-stop layers by use of dual hard mask (dHM) process combined with sidewall-hardening etching step. It is a key point to reduce shoulder loss d

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::82787f5ac5fd38150740aeeeee6ccf00
https://doi.org/10.1109/tsm.2008.2000268

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High Performance SiN-MIM Decoupling Capacitors with Surface-smoothed Bottom Electrodes for High-speed MPUs

Autor: Toshiki Shinmura, Koujirou Matsui, Masayuki Furumiya, Ippei Kume, Yoshihiro Hayashi, Shinobu Saitoh, Hiroto Ohtake, Takayuki Iwaki, Naoya Inoue, Takeshi Toda, Naoya Furutake, Koichi Ohto, Jun Kawahara

Publikováno v: Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::79d971518723e1dcbacd5ce07a7eb8ad
https://doi.org/10.7567/ssdm.2006.g-8-4

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Mechanical property control of Low-k Dielectrics for Diminishing CMP-related Defects in Cu-damascene Interconnects

Autor: Yoshihiro Hayashi, Tsuneo Takeuchi, M. Tagami, Hiroto Ohtake, Shinobu Saitoh, Kenichiro Hijioka, Fuminori Ito

Publikováno v: Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials.

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::19af6e04b0e0604f6422eed1f02b335c
https://doi.org/10.7567/ssdm.2003.c-5-2

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Process design methodology for via-shape-controlled, copper dual-damascene interconnects in low-k organic film

Autor: K. Kinoshita, K. Shiba, Shinobu Saitoh, Munehiro Tada, Yoshihiro Hayashi, M. Tagami, T. Onodera, T. Tonegawa, Tatsuya Usami, Masayuki Hiroi

Publikováno v: International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

By dual hard mask (dHM) process combined with sidewall-hardening etching step, copper dual-damascene (DD) interconnects are fabricated in low-k organic film without any etch-stop layers under the trench. Careful designs of dHM structures and their pa

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::5a6cc9d694cc1c2f94f26fc142eec3e1
https://doi.org/10.1109/iedm.2000.904305

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Damascene Cu-interconnect formation in benzocyclobuten (BCB) film using a novel end-point monitoring technique

Autor: Yoshihiro Hayashi, Jyun Kawahara, Takahiro Onodera, Shinobu Saitoh

Publikováno v: SPIE Proceedings.

Dual-damascene Cu-interconnect is fabricated in a low-k, divinylsiloxane-benzocyclobuten (DVS-BCB) film to reduce signal transmission delay among circuit-blocks on a chip. One of difficulties is how to make the patterns of via-holes and interconnect-

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::774c460086e7b0fcd3dd1d7c84fc4b7b
https://doi.org/10.1117/12.324023

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Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-kFilms

Autor: Ippei Kume, Makoto Ueki, Naoya Inoue, Jun Kawahara, Nobuyuki Ikarashi, Naoya Furutake, Shinobu Saitoh, Yoshihiro Hayashi

Publikováno v: Japanese Journal of Applied Physics. 50:04DB02

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4c631892aecc779f0894a938bac5faec
https://doi.org/10.7567/jjap.50.04db02

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Improvement of Uniformity and Reliability of Scaled-Down Cu Interconnects with Carbon-Rich Low-k Films

Autor: Makoto Ueki, Yoshihiro Hayashi, Ippei Kume, Naoya Inoue, Jun Kawahara, Shinobu Saitoh, Naoya Furutake, Nobuyuki Ikarashi

Publikováno v: Japanese Journal of Applied Physics. 50:04DB02

Highly selective dry-etching processes are developed for conventional via-first (VF) pattering sequences to fabricate reliable Cu dual-damascene interconnects (DDI) in carbon-rich low-k films, such as a molecular-pore-stack (MPS) SiOCH film (k = 2.55

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::68b70930791aa6aa7b8123ad5f4083ff
https://doi.org/10.1143/jjap.50.04db02

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[Untitled]

Autor: Shinobu Saitoh

Publikováno v: Journal of the Society of Mechanical Engineers. 104:110-111

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ad67d37d765fb8103b0ab20270413efe
https://doi.org/10.1299/jsmemag.104.988_110

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Fatigue deformation behaviour and dislocation structures under two-step cyclic loading

Autor: Shigemi Sasaki, Yasuo Ochi, Shinobu Saitoh, Akira Ishii

Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 53:1508-1515

Fatigue tests with two-step cyclic loading (Low-High and High-Low stress change tests) were carried out on mild steel and stainless steel specimens with different slip characters. Plastic strain range Δep changed rapidly with the stress change, and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a6365bad37d663eb9f4129c960e6ecf2
https://doi.org/10.1299/kikaia.53.1508

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