Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Shinn-Juh Lai"'
Autor:
Wei-Chung Lo, Peng-Shu Chen, Chih-Sheng Lin, Sheng-Che Hung, Shih-Hsien Wu, Jui-Feng Hung, Zhe-Hui Lin, Ming-Jer Kao, John H. Lau, Shyh-Shyuan Sheu, Ming-Lin Li, Shinn-Juh Lai
Publikováno v:
International Symposium on Microelectronics. 2012:001221-001228
In this study, the electrical performance of a general TSV structure for high-frequency 3D IC integration applications is investigated. Emphasis is placed on the proposal of an analytical model and the analytical equations of a TSV with all its key p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5c63ebfb6fdc75bbba42bd48b7fc4de
https://doi.org/10.4071/isom-2012-thp63
https://doi.org/10.4071/isom-2012-thp63
Autor:
Shyh Shyuan Sheu, Zhe Hui Lin, Peng Shu Chen, Wei Chung Lo, Tzu Kun Ku, Shih Hsien Wu, Jui Feng Hung, Ming Jer Kao, Kuo-Hsing Cheng, Chih-Sheng Lin, Shinn Juh Lai, John H. Lau, Keng Li Su
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 8:140-145
This paper proposes a 3D IC integration TSV testing apparatus, primarily using at least one set of TSV component testing devices with a specific design. Under complex technological conditions, such as varying depth-width ratios of TSVs and heterogene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efec7f4b457a83feee189f2bd704565c
https://doi.org/10.4071/imaps.307
https://doi.org/10.4071/imaps.307
Autor:
Shyh-Shyuan Sheu, Zue-Hua Lin, Jui-Feng Hung, John H. Lau, Peng-Shu Chen, Shih-Hsien Wu, Keng-Li Su, Chih-Sheng Lin, Shinn-Juh Lai, Tzu-Kun Ku, Wei-Chung Lo, Ming-Jer Kao
Publikováno v:
International Symposium on Microelectronics. 2011:000208-000214
This paper proposes a 3D IC integration TSV testing apparatus, primarily using at least one set of TSV component testing devices with a specific design. Under complex technological conditions, such as varying depth-width ratios of TSVs and heterogene
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7e17d956c55c97f0b51f9b505e474f9d
https://doi.org/10.4071/isom-2011-tp1-paper5
https://doi.org/10.4071/isom-2011-tp1-paper5
Autor:
Cheng-Hua Tsai, Chin-Sun Shyu, Meng-Sheng Chen, Wei Li, Min-Lin Lee, Chang-Sheng Chen, Hsun Yu, Ra-Min Tain, Shinn-Juh Lai, Wei-Ting Chen, Li-Chi Chang, Chang-Chih Liu
Publikováno v:
2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Embedded Passives (EPs) are considered an attractive option to design RF-SiP (System in Package) modules. EPs are benefit by the shortened interconnections between active or passive components, which can make better RF-SiP modules. In this paper, we
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27478c475a85ead55b2cb2da67d347a9
https://doi.org/10.1109/edaps.2012.6469427
https://doi.org/10.1109/edaps.2012.6469427
Autor:
Chang-Sheng Chen, Syun Yu, Cheng-Hua Tsai, Li-Chi Chang, Jungle Lee, Shinn-Juh Lai, Chin-Sun Shyu
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
In recent years, fashion mobile phones and other portable electronic products constantly challenge extreme slim design and then they stimulate a rapid development for SiP (system in package) technology. Traditional SMT (Surface Mount Technology) appr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59af05c19e37b71245cfd17d9c266d49
https://doi.org/10.1109/impact.2012.6420304
https://doi.org/10.1109/impact.2012.6420304
Autor:
Shyh-Shyuan Sheu, Shih-Hsien Wu, John H. Lau, Peng-Shu Chen, Pei-Jer Tzeng, Tzu-Kun Ku, Zhe-Hui Lin, Ming-Jer Kao, Jui-Feng Hung, Wei-Chung Lo, Ming-Lin Li, Shinn-Juh Lai
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
In this study, a method to test blind TSVs in 3D IC integration for their electrical performance is investigated. Emphasis is placed on the development of a novel blind-TSV method by electrical testing on the top side of the TSV-wafer before backgrin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::828f3c1780065e79ecffa89d738d92cc
https://doi.org/10.1109/ectc.2012.6248886
https://doi.org/10.1109/ectc.2012.6248886
Autor:
Shyh-Shyuan Sheu, Zhe-Hui Lin, Shin-Ge Lee, Ming-Jer Kao, Wei-Chung Lo, Peng-Shu Chen, Jui-Feng Hung, Chun-Te Lin, S. H. Wu, Tzu-Kun Ku, John H. Lau, K. L. Su, Shinn-Juh Lai
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
In this study, an on chip bus driver TEG (test element group) has been developed for the data transmission performance at TSVs for 3D IC integration. The on chip bus driver TEG consists of transceiver (TX), receiver (RX) and TSV group which has 2, 4
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61c007ae4717b456c95c35028811c36a
https://doi.org/10.1109/ectc.2012.6248933
https://doi.org/10.1109/ectc.2012.6248933
Autor:
Cheng-Hua Tsai, Li-Chi Chang, Chen, Chang-Sheng, Syun Yu, Chin-Sun Shyu, Shinn-Juh Lai, Jungle Lee
Publikováno v:
2012 7th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 1/ 1/2012, p419-422, 4p
Publikováno v:
2008 2nd Electronics Systemintegration Technology Conference.
System in package (SiP) plays an important role in the mobile communication market, while it can efficiently improve the size shrinkage, cost-effectiveness and available time of the products. Good achievements have been realized by other works in the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eacdfa28af621f991d7b08907357d8b5
https://doi.org/10.1109/estc.2008.4684346
https://doi.org/10.1109/estc.2008.4684346
Publikováno v:
2008 2nd Electronics System-Integration Technology Conference; 2008, p181-186, 6p