Zobrazeno 1 - 10
of 60
pro vyhledávání: '"Shin-puu Jeng"'
Autor:
Shin-Puu Jeng, Monsen Liu
Publikováno v:
2022 International Electron Devices Meeting (IEDM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e0131eb5712c00df881e5c3da19b27e
https://doi.org/10.1109/iedm45625.2022.10019517
https://doi.org/10.1109/iedm45625.2022.10019517
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8db20900de3a7a0364e97a3e6a17f0d0
https://doi.org/10.1109/ectc51906.2022.00008
https://doi.org/10.1109/ectc51906.2022.00008
Autor:
Shin-Puu Jeng, Ming-Chih Yew, Ching-Fang Chen, Cheng-Hsiang Hsieh, Po-Yao Lin, Shu-Shen Yeh, H. K. Cheng, Szu-Ying Chen, Y. J. Lu, Lin Chia-Hsiang, Chuang Po-Yao
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Organic interposer (CoWoS®-R) is one of the most promising heterogeneous integration platform solutions for high-speed and artificial intelligence applications. Components such as chiplets, high-bandwidth memory, and passives can be integrated into
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94b20ba3ac9663d0325b9ccfec4da6ed
https://doi.org/10.1109/ectc32696.2021.00125
https://doi.org/10.1109/ectc32696.2021.00125
Autor:
Jin-Hua Wang, Y. C. Lee, Po-Chen Lai, S. K. Cheng, Y. S. Lin, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Ming-Chih Yew, C. H. Chen, Shin-Puu Jeng
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
In order to ensure good performance and long-term reliability of fan-out package, the interfacial strength of Underfill (UF) and polymer (PM) lamination plays an important role because of physical strength and electrical requirement. Accordingly, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5aad2a8d1cde9ce59562e0516141a854
https://doi.org/10.1109/ectc32696.2021.00159
https://doi.org/10.1109/ectc32696.2021.00159
Autor:
Shin-Puu Jeng, Po-Chen Lai, L. L. Liao, Jin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Chia-Kuei Hsu, Ming-Chih Yew, Y. S. Lin, S. K. Cheng, T. Y. Lee, C. H. Chen
Publikováno v:
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Underfill (UF) polymer (PM) structures are becoming increasingly popular in fan-out packages because they exhibit several advantages, such as protection from mechanical stress and package- to-system electrical and thermal conductivity. The laminate i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16b731f75868f80bbbb96815acf1ac97
https://doi.org/10.1109/impact50485.2020.9268535
https://doi.org/10.1109/impact50485.2020.9268535
Autor:
Po-Yao Chuang, Shin-Puu Jeng, L.-L Liao, Wu Yi-Wen, Szu-Ying Chen, Chia-Kuei Hsu, Hung Shih-Ting, Lin Meng-Liang, Ming-Chih Yew, Tsai Po-Hao, D.-C. Wong, S. K. Cheng, P.-Y. Lai
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
A new ultra-thin high-density hybrid package that combines fan-out RDL with a backside laminated interposer is developed for mobile applications. The package features up to six fan-out RDL layers for chiplet integration and two to four routing layers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bca53dd4dbbca2648641805680dd97ce
https://doi.org/10.1109/ectc32862.2020.00061
https://doi.org/10.1109/ectc32862.2020.00061
Autor:
Po-Chen Lai, Chia-Kuei Hsu, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng, Che-Chia Yang, S. K. Cheng, Jin-Hua Wang, Po-Yao Lin, Dion Tseng, Ming-Chih Yew
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level package (FOWLP) is a disruptive technology in the semiconductor packaging industry. Demand for higher system performance has caused an increase in both package size and the complexity of heterogeneous integration. Large warpage, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7ddecf120305b9e2cbe27cde5d29e4c
https://doi.org/10.1109/ectc32862.2020.00174
https://doi.org/10.1109/ectc32862.2020.00174
Autor:
Kuang-Chun Lee, Po-Chen Lai, Chia-Kuei Hsu, Shu-Shen Yeh, Wen-Yi Lin, Ming-Chih Yew, Jin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Che-Chia Yang
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Board level reliability during drop impact is a major concern for electronic packages. The impact force generated as the casing strikes the ground can cause electronic device failures in handheld products. The full drop testing procedure is costly an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32fed20ea8472849e98f86c60b3fa32a
https://doi.org/10.1109/ectc.2019.00238
https://doi.org/10.1109/ectc.2019.00238
Autor:
Po-Chen Lai, Jin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng, Li-Ling Liao, Yu-Sheng Lin, Che-Chia Yang, Chia-Kuei Hsu, Kuang-Chun Lee, Shu-Shen Yeh, Wen-Yi Lin
Publikováno v:
2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Warpage has always been an important issue in electronic packaging, especially for fan-out and flip-chip chip scale packages (fcCSP). The molded underfill for encapsulation plays a key role in warpage control. It is critical to establish a fundamenta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0c6680f73b2fd9805e532444b551baf
https://doi.org/10.1109/impact.2018.8625838
https://doi.org/10.1109/impact.2018.8625838
Autor:
Po-Chen Lai, Shin-Puu Jeng, Che-Chia Yang, Po-Yao Lin, Wen-Yi Lin, Chia-Kuei Hsu, Jin-Hua Wang, Shu-Shen Yeh, Kuang-Chun Lee, Ming-Chih Yew
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
The molded underfill (MUF) offers many unique advantages, including lower material costs, higher throughput, and excellent reliability for flip-chip chip scale packages (fcCSP) and fan-out packages. The assembly process yield and reliability of these
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f20bee334ae4e25c33e25665a41f6ffc
https://doi.org/10.1109/ectc.2018.00046
https://doi.org/10.1109/ectc.2018.00046