Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Shin-ichi Zenbutsu"'
Publikováno v:
ECS Transactions. 34:825-829
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85c4208d764c516668d23f5d33a03323
https://doi.org/10.1149/1.3567680
https://doi.org/10.1149/1.3567680
Autor:
Andy Tseng, Hidetoshi Seki, Nicholas Liao, Louie Huang, Chen Ping, Shin-ichi Zenbutsu, Curtis Chen, Peng Su, Winnie Tai, Shingo Itoh, Yoshinori Nishitani, Bill Liu
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
The transitions to copper (Cu) from gold (Au) bond wires is occurring for an increasingly broader range of semiconductor components. For ball grid array (BGA) packages, key packaging materials including molding compound and substrate all need to be r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3386e7e538f7e58092801a73109e8b49
https://doi.org/10.1109/ectc.2012.6248974
https://doi.org/10.1109/ectc.2012.6248974
Autor:
Bill Liu, Shingo Itoh, Nicholas Liao, Hidetoshi Seki, Chen Ping, Shin-ichi Zenbutsu, Curtis Chen, Peng Su, Andy Tseng, Louie Huang, Winnie Tai
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Copper (Cu) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for these components are expanding from consumer to high-reliability electronic systems. To assess the impact of this conversio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cbc7a66b666a5c749ddeb3c5dc2dbd7
https://doi.org/10.1109/ectc.2011.5898539
https://doi.org/10.1109/ectc.2011.5898539
Publikováno v:
2010 IEEE CPMT Symposium Japan.
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b8967a1195c8ad81c4f4f80b70205a5c
https://doi.org/10.1109/cpmtsympj.2010.5679680
https://doi.org/10.1109/cpmtsympj.2010.5679680