Zobrazeno 1 - 10
of 33
pro vyhledávání: '"Shin-Yueh Yang"'
Autor:
Shin-Yueh Yang, 楊炘岳
95
Flexural ridge wave propagation around a circular cylindrical tube has no exact solution up to the present. It is used to be solved numerically or using an empirical formula. This thesis investigates the dispersive properties of ridge waves t
Flexural ridge wave propagation around a circular cylindrical tube has no exact solution up to the present. It is used to be solved numerically or using an empirical formula. This thesis investigates the dispersive properties of ridge waves t
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/25569130026543325793
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37f3f54dc028e9011df303f9c1914c51
https://doi.org/10.1109/eptc53413.2021.9663944
https://doi.org/10.1109/eptc53413.2021.9663944
Publikováno v:
Journal of Electronic Materials. 44:2497-2506
The current market demand for high-efficiency, high-performance, small-sized electronic products has focused attention on the use of three-dimensional (3D) integrated circuits (IC) in the design of electronic packaging. Silicon wafers can be ground a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f3e5040844bf8b63f1fa8f30a3974e3
https://doi.org/10.1007/s11664-015-3807-4
https://doi.org/10.1007/s11664-015-3807-4
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1152-1158
3-D chip stacking packaging is becoming increasingly popular in the electronics packaging industry because the demand of current market has focused on cheaper products with higher performance characteristics and smaller form factors. Silicon wafers m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2279a80385980151d70ac3de5f5bb5ad
https://doi.org/10.1109/tcpmt.2014.2312987
https://doi.org/10.1109/tcpmt.2014.2312987
Publikováno v:
Microelectronics Reliability. 52:794-803
Light-emitting diodes (LEDs), which are generally used for indicator lights, have been continuously developed for the past 50 years. With an urgent need for energy conservation and pollution reduction, the trend of replacing traditional incandescent
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c50bb3470bc4a7ef2a991e95476e9758
https://doi.org/10.1016/j.microrel.2011.07.059
https://doi.org/10.1016/j.microrel.2011.07.059
Publikováno v:
Microelectronics Reliability. 51:1757-1761
Silicon oxide material, which has low-refractive index and high isolation characteristic, has been extensively adopted into high-brightness LED structures. However, the interfacial delamination problem between GaP and SiO2 was observed in the high-br
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a67ae2e801b3a9b714e8f53db60cfca8
https://doi.org/10.1016/j.microrel.2011.06.045
https://doi.org/10.1016/j.microrel.2011.06.045
Publikováno v:
Thin Solid Films. 519:7883-7894
Residual stresses arising from thermal mismatch in layered structures rank among the major causes of mechanical failures in light-emitting diodes, integrated circuits, electronic packages, and micro-electro-mechanical systems. Applying analytical sol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8df1fa07aa7f1a84c5db534c29ab6ec7
https://doi.org/10.1016/j.tsf.2011.04.220
https://doi.org/10.1016/j.tsf.2011.04.220
Publikováno v:
Finite Elements in Analysis and Design. 47:635-642
This paper describes a modal separation model that improves the performance of wedge wave ultrasonic motors (WW-USMs) using the bi-dimensional finite element analysis (Bi-d FEA) method. Most USMs operate near the resonant frequency of a specific vibr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fdbfa82123e4e01da459f061a6205755
https://doi.org/10.1016/j.finel.2011.01.006
https://doi.org/10.1016/j.finel.2011.01.006
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:713-721
Light emitting diode (LED) with a long lifetime, low power consumption, and low pollution has been successfully applied in many products. However, due to its low electro-optical conversion efficiency, high percentage of input power transformed to red
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5388e4325a7f45c57faca45dc945519e
https://doi.org/10.1109/tcapt.2010.2073469
https://doi.org/10.1109/tcapt.2010.2073469
Publikováno v:
Microelectronic Engineering. 87:496-500
As the electronics industry continues its efforts in miniaturizing the integrated circuit (IC), an IC chip with copper/low-k stacked Back End of Line (BEoL) structures has been developed for reducing R-C delay in order to obtain high-speed signal com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::66020c7a34941829dcf5c6decd1c3bb7
https://doi.org/10.1016/j.mee.2009.07.003
https://doi.org/10.1016/j.mee.2009.07.003