Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Shin-Chieh Tsai"'
Autor:
Wen-Chang Huang, Jo Lun Chiu, Xin Dai Lin, Yu Ching Lin, Shin Chieh Tsai, Wei Ming Su, Chen Yuan Weng, Chien Cheng Lu, Chia Feng Lin, Hsiang Chen
Publikováno v:
Results in Physics, Vol 10, Iss , Pp 132-137 (2018)
In this research, graphene was incorporated into the ZnO nanorods (NRs) growth in two different ways to enlarge the rod diameter of ZnO NRs on porous silicon (PS) substrates. We etched the P-type Si (1 0 0) wafer to form the PS layer in solution with
Externí odkaz:
https://doaj.org/article/ecc6057d4b9e49c59c0d6deba3c4bcef
Autor:
Shin Chieh Tsai, Hsiang Chen, Yu Ching Lin, Chen Yuan Weng, Jo Lun Chiu, Chia-Feng Lin, Chien Cheng Lu, Wen-Chang Huang, Xin Dai Lin, Wei Ming Su
Publikováno v:
Results in Physics, Vol 10, Iss, Pp 132-137 (2018)
In this research, graphene was incorporated into the ZnO nanorods (NRs) growth in two different ways to enlarge the rod diameter of ZnO NRs on porous silicon (PS) substrates. We etched the P-type Si (1 0 0) wafer to form the PS layer in solution with
Autor:
Chan-Yu Lin, Wang Ting Chiu, Luo Yang, Hsiang Chen, Ting Wei Chang, Ching-Tsan Tsai, Chyuan Haur Kao, Shin Chieh Tsai, Yi Cian Chen
Publikováno v:
Vacuum. 140:3-6
Ion-sensitive field - effect transistor (ISFET) biosensors were fabricated with a pH-sensitive Ba x Sr 1−x TiO 3 membrane on silicon substrates in an Electrolyte-Insulator-Semiconductor (EIS) structure. To investigate the effects of annealing in N
Publikováno v:
Journal of Medical Imaging and Health Informatics. 6:102-107
Publikováno v:
ICPADS
Trace-driven simulation has been used widely for architectural exploitation in electronic system-level (ESL) designs for complex SoCs (system-on-chips). Most often the trace files are provided by third parties without source code. This makes it diffi
Autor:
Yow-Chyun Shyu, Shin Chieh Tsai, Wei Min Su, Chien-Cheng Lu, Cheng-Yuan Weng, Lee Yu Shan, Hong Chen Hao, Jing-Jenn Lin, Chia Feng Lin, Chang-Tze Ricky Yu, Yi Cian Chen, Tzu-Yi Yu, Hsiang Chen
Publikováno v:
Journal of New Materials for Electrochemical Systems; 2016, Vol. 19 Issue 4, p229-233, 5p