Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Shih-Ying Chiang"'
Autor:
Shih-Ying Chiang, 江室瑩
96
The current market trend in electronic devices leans toward the use of small-sized and multi-functional devices. In particular, package design technologies like Wafer Level Package and Multi-Chip Module have been the widely used. With the com
The current market trend in electronic devices leans toward the use of small-sized and multi-functional devices. In particular, package design technologies like Wafer Level Package and Multi-Chip Module have been the widely used. With the com
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/32497144555026337287
Autor:
Shih-Ying Chiang, 蔣世英
94
As a result of the fast development of electronic commerce, the quality request for the network server service has also relatively been enhanced. It’s an important issue that the existing network server can provide the high efficient and th
As a result of the fast development of electronic commerce, the quality request for the network server service has also relatively been enhanced. It’s an important issue that the existing network server can provide the high efficient and th
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/08052182982535001746
Publikováno v:
Microelectronics Reliability. 51:1819-1823
Two analytical methods were proposed in this research, coupled electro-thermal finite element (FE) analysis and thermal–mechanical FE analysis, to analyze the mechanical behavior of bonding wire of power module under cyclic power loads, and the Int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::470112d4d8eb02422b5ffeed685eb4a9
https://doi.org/10.1016/j.microrel.2011.06.048
https://doi.org/10.1016/j.microrel.2011.06.048
Publikováno v:
Microelectronic Engineering. 88:785-790
High-concentration photovoltaic (HCPV) module is subject to larger thermal stress due to its more severe temperature fluctuation in real operating conditions. In the thermal cycling test, excessive thermal stress might occur at the peripheral solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eddf22f1d1e2228d5e47c24f542e5bb8
https://doi.org/10.1016/j.mee.2010.07.033
https://doi.org/10.1016/j.mee.2010.07.033
Publikováno v:
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The Insulated Gate Bipolar Transistor (IGBT) module subjected to a power cycle test will induce a heat concentration zone, rapid change of temperature profile and non-uniform temperature distribution on the IGBT chip. The variation of junction temper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d34e4a21280aee3ad9d25c6822b48074
https://doi.org/10.1109/esime.2011.5765766
https://doi.org/10.1109/esime.2011.5765766
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1.
The characteristic of MEMS component is affected by different process procedures such as depositing and etching thin films on substrate. These processes might induce residual stresses or deformations in MEMS component, which will reduce its efficienc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c6a408d625875f9fd40a695a7431cbe6
https://doi.org/10.1115/ipack2011-52201
https://doi.org/10.1115/ipack2011-52201
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Due to stringent environmental regulations, a solar power plant that produces energy without pollution has gained more attention in recent years. The high-concentration photovoltaic (HCPV) module is one of the popular solar energy systems due to its
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26cf5e597549ea1e4d20dc1ed6cf918d
https://doi.org/10.1109/impact.2010.5699530
https://doi.org/10.1109/impact.2010.5699530
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Insulated gate bipolar transistors (IGBT) have been utilized in high power and fast switching applications for power management. Research on transient thermal performance assessment has become imperative because of the excessive heat generated from t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98b47a5d2d7176990488ab79ac1dbbbc
https://doi.org/10.1109/itherm.2010.5501341
https://doi.org/10.1109/itherm.2010.5501341
Autor:
Shih-Ying Chiang, Ning-Yuan Wang, Kuo-Ning Chiang, Hwen-Fen Hong, Tsung-Lin Chou, Zun-Hao Shih
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Based on the standard of International Electrotechnical Commission (IEC) on the thermal cycling test for a high concentration photovoltaic (HCPV) module, frequent current input must be applied when oven temperature exceeds 25°C. As such, the junctio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37e854c12a02e18f40db7239ad55884f
https://doi.org/10.1109/itherm.2010.5501253
https://doi.org/10.1109/itherm.2010.5501253
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
The system-in-package (SiP) is among the popular package structures which meet the trend of integrated circuit (IC) product development. The SiP structure investigated in this study includes seven sub-chips attached to the chip carrier, with polymer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fa4802afa9c173a4da0a4ad2c32d2dd
https://doi.org/10.1109/impact.2009.5382307
https://doi.org/10.1109/impact.2009.5382307