Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Shih-Hsiung Tseng"'
Autor:
Shih-Hsiung Tseng, 曾仕雄
103
Nowadays, people are concern about their health issues. Thus, the health food products are growing up rapidly, and different areas of field firefighters that distinguish between city, suburbs and remote areas relationships with their duty, p
Nowadays, people are concern about their health issues. Thus, the health food products are growing up rapidly, and different areas of field firefighters that distinguish between city, suburbs and remote areas relationships with their duty, p
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/34y49g
Publikováno v:
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).
This study presents the piezoelectric MEMS microspeaker design in Fig. 1a with four triangular plates, a connection mass, and dual driving electrodes (inner and outer electrodes) to increase the sound pressure level (SPL). By integrating the microspe
Publikováno v:
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS).
This study designs and realizes an improved piezoelectric MEMS microphone with four triangular-cantilevers (Fig. 1) on a commercial 8-inch wafer. As compared with the reference design [1], this study exhibits two merits: (1) special boundary and stru
Autor:
Sung-Cheng Lo, Mingching Wu, Jhih-Jhe Wang, C.-E. Lu, Jing-Yi Huang, Shih-Hsiung Tseng, Weileun Fang
Publikováno v:
2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS).
This study based on piezo-electric sensing principle to develop a high S/N ratio MEMS microphone. The patterned PZT and electrodes designed implemented above the clamped diaphragm to generate high stress concentration on PZT and Si bimorph diaphragm.
Publikováno v:
Medicine & Science in Sports & Exercise. 48:753
Publikováno v:
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).
This study extends the authors' previous concept to employ nanoporous anodic aluminum oxide (np-AAO) as insulation and dielectric layer [1] to form the vertical-integrated inductive-capacitive proximity sensor. The advantages of this vertical-integra
Publikováno v:
Journal of Micromechanics and Microengineering. 23:035013
This study designs and implements a proximity sensor consisting of inductive and capacitive sensing units. These two sensing units are vertically monolithic integrated on a single chip using the micro-fabrication processes. In addition, low-temperatu