Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Shih-Haur Shen"'
Autor:
Ingemar Carlsson, Bogdan Swedek, Fritz Redeker, Katrina Mikhaylich, Tomohiko Kitajima, Brian J. Brown, Kun Xu, Sidney P. Huey, Shou-sung Chang, Wen-chiang Tu, Hassan G. Iravani, Shih-Haur Shen, Tzu-Yu Liu, Jason G. Fung
Publikováno v:
ECS Journal of Solid State Science and Technology. 5:P361-P367
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0174a413c9ae4afc7e17c926f06c9f1
https://doi.org/10.1149/2.0371606jss
https://doi.org/10.1149/2.0371606jss
Publikováno v:
Industrial & Engineering Chemistry Research. 44:4676-4686
This work compliments and extends the capability of the run-to-run (R2R) control by sequencing the incomings such that improved control performance can be achieved. Unlike chemical or mechanical systems, this is important for semiconductor manufactur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e44404cbab64f2a126abf510152bbf2
https://doi.org/10.1021/ie0491544
https://doi.org/10.1021/ie0491544
Publikováno v:
Microelectronic Engineering. 65:345-356
In chemical mechanical polishing (CMP), a two-stage polishing strategy is often employed. A high removal rate (RR) is set at the initial stage, then a lower RR is employed to remove residual metal and extended to the over-polish stage. An analogy bet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::358a5ae250224b6bd068bdab2222ff26
https://doi.org/10.1016/s0167-9317(02)01024-9
https://doi.org/10.1016/s0167-9317(02)01024-9
Publikováno v:
Microelectronic Engineering. 65:61-75
The unusual concentration effect in copper chemical mechanical polishing (CMP) is verified experimentally and operation-relevant models are derived. First, the well-known Preston equation is modified by taking the concentration effects into account.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f1cedab71b1a716a05a6146086482f6
https://doi.org/10.1016/s0167-9317(02)00729-3
https://doi.org/10.1016/s0167-9317(02)00729-3
Publikováno v:
Automatica. 36:705-715
Rapid thermal processing (RTP) offers a growing potential in integrated circuit manufacturing as the feature sizes in ULSI move further down into the subhalf micrometer technology. The main problem of RTP control lies in temperature uniformity. In th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::443e82860be4271d83b1ac37d342295f
https://doi.org/10.1016/s0005-1098(99)00197-1
https://doi.org/10.1016/s0005-1098(99)00197-1
Publikováno v:
Journal of Process Control. 9:161-169
Autotuning based on relay feedback tests have received a great deal of attention recently. The relay feedback tests fail to generate sustained oscillation in some cases. For systems with RHP poles and/or zeros, incorrect autotune identification proce
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::101e0f7a658b7ce6a377a0a490861e6b
https://doi.org/10.1016/s0959-1524(98)00035-3
https://doi.org/10.1016/s0959-1524(98)00035-3
Publikováno v:
AIChE Journal. 42:1174-1180
The purpose of this work is to devise a relay feedback experiment that can identify two points on the Nyquist curve from a single test at the frequencies ω=0 and ω=ω u . An identification procedure is devised accordingly for this parameter identif
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59218394901401c2065c2a68506c7d87
https://doi.org/10.1002/aic.690420431
https://doi.org/10.1002/aic.690420431
Publikováno v:
Chemical Engineering Science. 51:1187-1198
Despite the success of the relay-feedback system in autotune identification, it is well known that an ideal (on-off) relay-based identification can lead to significant error in the ultimate gain and ultimate frequency. Instead of taking remedial acti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7b0c6e6f58c9f8089cd754c57fa87a08
https://doi.org/10.1016/0009-2509(95)00371-1
https://doi.org/10.1016/0009-2509(95)00371-1
Autor:
Shih-Haur Shen, Cheng-Ching Yu
Publikováno v:
The Canadian Journal of Chemical Engineering. 74:132-143
The importance of obtaining consistent steady-state gains increases as the expected level of performance increases. A new consistency relationship is derived to ensure that the steady-state gains identified are physically correct. In addition to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed877f39da8d2b2c4da1a1ba0ebbf152
https://doi.org/10.1002/cjce.5450740117
https://doi.org/10.1002/cjce.5450740117
Autor:
Haichun Yang, Naomi Yoshida, W. Ch. Tu, X. Xia, L. W. Chang, You Wang, M. Okazaki, Z. Ge, Kun Xu, Shih-Haur Shen, B. Liu, M. Allen, Lakshmanan Karuppiah, Adam Brand, Yu Lei
Publikováno v:
MRS Proceedings. 1372
For the gate last approach of a high K metal gate scheme used in advanced CMOS technology, various materials were tested as wetting layers to allow Aluminum (Al) gap fill at gate widths of10 to 45 nanometers. In this study, Titanium (Ti) and Cobalt (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7704fa60f1e5fac569975b935fac269b
https://doi.org/10.1557/opl.2012.113
https://doi.org/10.1557/opl.2012.113