Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Shih Yen Chou"'
Publikováno v:
Microelectronic Engineering. 177:52-58
This study presents a direct fabrication process of nanofiber scaffolds within a pillar-based microfluidic device by using electrospinning and picosecond laser pulses. The picosecond laser irradiation source is a type of ultrafast laser, which facili
Autor:
Kuan-Ming Li, Shih-Yen Chou
Publikováno v:
Journal of Materials Processing Technology. 210:2163-2170
This paper presents the performance of the minimum quantity lubrication (MQL) technique in near micro-milling with respect to dry cutting on the basis of tool wear, surface roughness and burr formation. The effects of tool materials, oil flow rate an
Autor:
Shih, Yen-Chou, 施彥舟
102
In recent years, as energy issues receive more and more attention,various energy education websites have also gradually increased in number. Foreign energy education websites use multiple colors, such as orange,yellow, red and black, while d
In recent years, as energy issues receive more and more attention,various energy education websites have also gradually increased in number. Foreign energy education websites use multiple colors, such as orange,yellow, red and black, while d
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/71976719167161060799
Autor:
Shih-yen Chou, 周士嚴
97
Product miniaturization is a long-term trend. Mechanical micro-machining is a suitable technique for manufacturing of microstructures characterized by cheap equipments, less working time, and possible complex geometry. For the requirements fo
Product miniaturization is a long-term trend. Mechanical micro-machining is a suitable technique for manufacturing of microstructures characterized by cheap equipments, less working time, and possible complex geometry. For the requirements fo
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/pv4k9g
Publikováno v:
Computer Integrated Manufacturing Systems. 10:177
A system and method which includes a user interface for automation of the build sheet is provided. The database icon or command of the user interface is executed to select an appropriate package for an IC chip, and a blank bond master is downloaded t