Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Shigeyasu TSUBAKI"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 83, Iss 850, Pp 16-00580-16-00580 (2017)
We have developed the evaluation method for two performance factors to design the thermal connector: Insertion force of thermal grease and thermal conductance. The thermal connector was comprised of a thermal plug and a thermal socket, and the therma
Externí odkaz:
https://doaj.org/article/7fc56c436591419cbce8bfc54de56dec
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 80, Iss 820, Pp TEP0368-TEP0368 (2014)
A loop thermosyphon is known to have a higher heat transfer performance without a pump. In addition, there is demand for the reduction of the electricity needed for the fan used to cool the CPUs in a rack mount server. We more efficiently designed a
Externí odkaz:
https://doaj.org/article/9b8264c467854978ae9d58d5630a2e26
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 80, Iss 814, Pp TEP0154-TEP0154 (2014)
A loop thermosyphon is known that it has higher heat transfer performance without a pump. Thus, we have applied new loop thermosyphon to cool CPUs of a rack mount server. Thermosyphon uses gravity to return refrigerant from the condensation part to t
Externí odkaz:
https://doaj.org/article/d6430533d0ab485cb27e3b9ad659ba30
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 80, Iss 811, Pp TEP0043-TEP0043 (2014)
Heat density of high-load electronics such as high-performance servers and the inverters used in vehicles has been increasing as the result of higher processing speeds and computational scale, and higher output, etc. We therefore investigated an air-
Externí odkaz:
https://doaj.org/article/c58e6b84dd544b668af7bfb383b5f693
Publikováno v:
2020 IEEE 7th International Conference on Industrial Engineering and Applications (ICIEA).
In response to problems associated with the shortage of factory workers, the demand for efficiency maximization by eliminating wasted work has recently become stronger. Moreover, to ensure compliance with product quality, the demand for reliable work
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1531ba6fe97fcae8d812bce38d2b27c2
https://doi.org/10.1109/iciea49774.2020.9102053
https://doi.org/10.1109/iciea49774.2020.9102053
Publikováno v:
Transactions of the JSME (in Japanese). 83:16-00580
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2fdf634ed072c1df22ff6b0dfc890c3
https://doi.org/10.1299/transjsme.16-00580
https://doi.org/10.1299/transjsme.16-00580
Publikováno v:
Journal of Electronics Cooling and Thermal Control. :70-77
Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstream devices decreases the cooling capa-bility for the downstream devices. In this study we
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c08ff06e14216496c3c89c0798e8ac0
https://doi.org/10.4236/jectc.2014.43008
https://doi.org/10.4236/jectc.2014.43008
Publikováno v:
2016 IEEE International Ultrasonics Symposium (IUS).
An ASIC-integrated probe generates large amount of heat compared to that of a conventional probe. That causes to increase surface temperature and to degrade ultrasound diagnostic images in order not to exceed the temperature limits determined by the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d31286637f256a394d1d2beb37f9a47e
https://doi.org/10.1109/ultsym.2016.7728376
https://doi.org/10.1109/ultsym.2016.7728376
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 78:2030-2045
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08c89a2835b36ab80a4590ea67bf008c
https://doi.org/10.1299/kikaib.78.2030
https://doi.org/10.1299/kikaib.78.2030
Publikováno v:
The Proceedings of the Thermal Engineering Conference. 2013:245-246
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8757974ebb5c551c4cb7f1202fb2f1b2
https://doi.org/10.1299/jsmeted.2013.245
https://doi.org/10.1299/jsmeted.2013.245