Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Sherman E. Peek"'
Publikováno v:
IEEE Transactions on Applied Superconductivity. 33:1-5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83876dae616ba356e91f94170048c631
https://doi.org/10.1109/tasc.2023.3271950
https://doi.org/10.1109/tasc.2023.3271950
Publikováno v:
IEEE Transactions on Applied Superconductivity. 33:1-5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee5358f6009f68d536a82a10d8c3bec7
https://doi.org/10.1109/tasc.2023.3263811
https://doi.org/10.1109/tasc.2023.3263811
Autor:
Sherman E. Peek, Jacob Ward, Stephen Bankson, Archit Shah, John A. Sellers, Mark L. Adams, Michael C. Hamilton
Publikováno v:
Journal of Materials Research. 37:1978-1985
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b71855c59be2d2f6694e264a877cbefb
https://doi.org/10.1557/s43578-022-00610-5
https://doi.org/10.1557/s43578-022-00610-5
Autor:
Bhargav Yelamanchili, Archit Shah, Sherman E. Peek, Vaibhav Gupta, John A. Sellers, David B. Tuckerman, Michael C. Hamilton
Publikováno v:
IEEE Transactions on Applied Superconductivity. 32:1-5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82687edba047c3987740a26c001bc13a
https://doi.org/10.1109/tasc.2022.3149729
https://doi.org/10.1109/tasc.2022.3149729
Autor:
Md. Fahim F. Chowdhury, John A. Sellers, David B. Tuckerman, Bhargav Yelamanchili, Michael C. Hamilton, Uday S. Goteti, Archit Shah, Vaibhav Gupta, Asmaul Smitha Rashid, Sherman E. Peek
Publikováno v:
IEEE Transactions on Applied Superconductivity. 31:1-6
We describe our initial approach and progress towards a reliable and useful technique to connect multiple flexible superconducting cables using a cable-to-cable connector. The test structure comprises multiple components, including flexible thin-film
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5b8569fc23f7873d11bf3d490bbc56c
https://doi.org/10.1109/tasc.2021.3062566
https://doi.org/10.1109/tasc.2021.3062566
Autor:
Michael C. Hamilton, Bhargav Yelamanchili, Archit Shah, Sherman E. Peek, Stephen Bankson, Chase C. Tillman
Publikováno v:
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a548dfcbe555816981d5970b658fed3
https://doi.org/10.1109/ims37962.2022.9865377
https://doi.org/10.1109/ims37962.2022.9865377
Autor:
Archit Shah, Sherman E. Peek, Bhargav Yelamanchili, Vaibhav Gupta, David B. Tuckerman, Chris Cantaloube, John A. Sellers, Michael C. Hamilton
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ee3045f118a49aa0cdd94c19dbd9d01
https://doi.org/10.1109/ectc51906.2022.00052
https://doi.org/10.1109/ectc51906.2022.00052
Autor:
Haitao Dai, Corey Kegerreis, Deepal Wehella Gamage, Jonathan Egan, Max Nielsen, Yuan Chen, David Tuckerman, Sherman E Peek, Bhargav Yelamanchili, Michael Hamilton, Rabindra N Das, Anna Herr, Quentin Herr
Interconnect properties position superconducting digital circuits to build large, high performance, power efficient digital systems. We report a board-to-board communication data link, which is a critical technological component that has not yet been
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::30d92edc840a12f5a391bf233a4d6932
http://arxiv.org/abs/2109.01808
http://arxiv.org/abs/2109.01808
Autor:
Flavio Griggio, Archit Shah, George H. Thiel, David B. Tuckerman, John A. Sellers, Bhargav Yelamanchili, Sherman E. Peek, Emma R. Schmidgall, Michael C. Hamilton, Vaibhav Gupta, Samuel d'Hollosy
Publikováno v:
IRPS
We present reliability characterization of a polyimide/copper-based flexible interconnect designed for cryogenic and quantum computing applications. This interconnect design uses commercial fabrication processes and off-the-shelf parts. Experiments w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb0821f731e9a958026514d7b976b8d4
https://doi.org/10.1109/irps46558.2021.9405090
https://doi.org/10.1109/irps46558.2021.9405090
Autor:
Sherman E. Peek, Archit Shah, Bhargav Yelamanchili, Vaibhav Gupta, John A. Sellers, David B. Tuckerman, Michael C. Hamilton
Publikováno v:
IOP Conference Series: Materials Science and Engineering. 1241:012027
Design, fabrication, and testing of cryogenic cables with thermal performance considerations is presented in this work. Cables were designed with commercial off-the-shelf materials for low-GHz operation in a small form factor. Thermal and microwave s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f76be19dbe970e1ec2a460e2d8515b6c
https://doi.org/10.1088/1757-899x/1241/1/012027
https://doi.org/10.1088/1757-899x/1241/1/012027