Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Shenquan Ou"'
Publikováno v:
ASME 2009 InterPACK Conference, Volume 1.
Electromigation behavior of solder joints with thick Cu column was studied. The failure mechanisms for both SnPb and SnAg solder joints were discussed. To better understand the mechanisms, voids nucleation and propagation were also studied through Ke
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abccfd9f689807c993d574b42ad07540
https://doi.org/10.1115/interpack2009-89023
https://doi.org/10.1115/interpack2009-89023
