Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Shengzong He"'
Publikováno v:
International Symposium on Microelectronics. 2019:000369-000372
The wire breakage of a no-cleaning process PCBA occurs at the beginning of the application. Through visual inspection, cross-section, SEM & EDS, and ion chromatography analysis, it was found that the high content of ions (bromide ion) on the surface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f57b661f5eb616bfad9d56857d26c50
https://doi.org/10.4071/2380-4505-2019.1.000369
https://doi.org/10.4071/2380-4505-2019.1.000369
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Chip with bonding wires and lead frame of a plastic encapsulated device is sealed with molding compound to prevent any foreign matters from getting inside. This work is completed during the process called as molding process, which is a very important
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0aa1d2655473494a0ca4b5680da993ac
https://doi.org/10.1109/icept50128.2020.9202908
https://doi.org/10.1109/icept50128.2020.9202908
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
this research paper introduces the development and principle of the lasers, state the common semiconductor laser fabrication process in detail, and summarize, emphasize the laser application in the IC and MEMs fabrication process. With the help of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a68a1bbe8cc2b28c786160a337f7020d
https://doi.org/10.1109/icept50128.2020.9202701
https://doi.org/10.1109/icept50128.2020.9202701
Publikováno v:
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
The strain distributions in the MLCC during the wave soldering are analyzed with the use of the birth-death element strategy. It is confirmed that the larger size of MLCC is more sensitive to the thermal shock of the wave soldering, while the increas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7761b618db1d0c798db7e694a3e64f0
https://doi.org/10.1109/icept47577.2019.245192
https://doi.org/10.1109/icept47577.2019.245192
Publikováno v:
2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Silver alloy wires with the advantage of low cost, good thermal conductivity and electrical conductivity have been adopted in packaging industry [1, 2]. For plastic encapsulated microelectronics (PEMs) conventional wet decapsulation method is widely
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35791d89bc482e105600585656ef604d
https://doi.org/10.1109/ipfa.2017.8060206
https://doi.org/10.1109/ipfa.2017.8060206
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Optocouplers are devices that block light in one direction but allow light to pass in the opposite direction which are widely used in long distance signal transmission, pulse amplifying circuits and telecommunication equipment. The unique constructio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97bf61b8b2cf2e23d097e2afd98ba5f3
https://doi.org/10.1109/icept.2016.7583348
https://doi.org/10.1109/icept.2016.7583348
Publikováno v:
Electronics Letters. 50:884-886
It has been reported that subharmonic instability exists in the V 2 controlled buck converter in continuous conduction mode (CCM) when the duty ratio is above 0.5 ( D > 0.5) and no stability issue exists in discontinuous conduction mode (DCM) when 0
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c5016432485d637c5120af97f63dc2dd
https://doi.org/10.1049/el.2014.0419
https://doi.org/10.1049/el.2014.0419
Publikováno v:
2014 10th International Conference on Reliability, Maintainability and Safety (ICRMS).
Reliability assessment test for smart electrical energy meters is specially designed based on the failure mechanism of the components used in the product. Firstly, malfunction data of the meters in the field is collected and classified. Failure analy
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f1c4431327c26f1578caf4e19bda8fd2
https://doi.org/10.1109/icrms.2014.7107307
https://doi.org/10.1109/icrms.2014.7107307
Publikováno v:
2014 15th International Conference on Electronic Packaging Technology.
Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygros
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c86dfc2eab876ea4670bff5a0623745
https://doi.org/10.1109/icept.2014.6922851
https://doi.org/10.1109/icept.2014.6922851
Publikováno v:
Electronics Letters (Wiley-Blackwell). 6/5/2014, Vol. 50 Issue 12, p884-885. 2p. 2 Graphs.