Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Sheng-Shu Yang"'
Autor:
Hao Tang, Raphael He, Gary Shi, Wei Zhang, Ming Yin, Sheng-Shu Yang, Hsiang-Hung Chang, My Nguyen
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging (FOWLP) not only provides simplified supply chain management and lower cost structure, but also enables thinner profile and heterogeneous system integration. FOWLP is becoming increasingly significant and is projected to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dc1babd966b5d8c1b375fcd35be7c6b0
https://doi.org/10.1109/ectc.2017.338
https://doi.org/10.1109/ectc.2017.338
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 33:71-78
Residual strains (stresses) of thin-layer adhesives are important and need be determined and further analyzed for better reliability design of the joints or bump joints in electronic or optoelectronic packaging. The purposes of this paper are to quan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bcfec54a4cfc80e5e0e9a208557e2f90
https://doi.org/10.1109/tcapt.2009.2026471
https://doi.org/10.1109/tcapt.2009.2026471
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:665-673
Regarding the application of the chip on glass (COG) with anisotropic conductive film (ACF) to the liquid crystal displays (LCDs), the problems with the warpage of COG packages, interfacial delamination, and increasing contact resistance of bumps, du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::689a029d73183ee3dcf1fb37f24d0a79
https://doi.org/10.1109/tadvp.2007.906393
https://doi.org/10.1109/tadvp.2007.906393
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 30:517-525
The use of nonconductive paste (NCP) or film adhesives to replace the anisotropic conductive film in chip on glass (COG) packages may be a possible solution for the low-cost and finer-bump-pitch application to the liquid crystal displays. However, wh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::906209ca2ff5e886c8fcaa3d7367282e
https://doi.org/10.1109/tcapt.2007.898691
https://doi.org/10.1109/tcapt.2007.898691
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:577-588
The warpage of glass substrate in chip-on-glass (COG) assemblies were believed to be the main cause of the so-called "Mura" phenomenon in thin-film transistor liquid crystal display (TFT-LCD) panels. The main objective of the study is to characterize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b546f9473e12d01cab95890ec49719fc
https://doi.org/10.1109/tcapt.2006.880507
https://doi.org/10.1109/tcapt.2006.880507
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:587-598
The purpose of this paper is to investigate the parameters such as thermal loads, adhesive material properties and fillets, bump materials, and moisture, affecting the warpage and bump-joint stresses of the chip-on-glass (COG) packages with anisotrop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ae594f44c2dfc94b1b7539c9e0715e7
https://doi.org/10.1109/tadvp.2006.875094
https://doi.org/10.1109/tadvp.2006.875094
Autor:
Chih Chen, Chao-Chyun An, Chung Kuang Lin, Ming-Yao Chen, Jimmy Tsang, Shyh-Ming Chang, Sheng-Shu Yang, Kuo-Shu Kao
Publikováno v:
2007 9th Electronics Packaging Technology Conference.
Non-conductive-film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e6c3b32c4ebc1090e0844dc9fc4bb7e7
https://doi.org/10.1109/eptc.2007.4469816
https://doi.org/10.1109/eptc.2007.4469816
Autor:
Chung Kuang Lin, Jimmy Tsang, Ming-Yao Chen, Wen-Chih Chen, Shyh-Ming Chang, Sheng-Shu Yang, Ren-Haw Chen, Chih Chen, Chao-Chyun An, Kuo-Shu Kao
Publikováno v:
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f92fdc8f33e3892332f280b6ba94a1bc
https://doi.org/10.1109/impact.2007.4433558
https://doi.org/10.1109/impact.2007.4433558
Autor:
M. Y. Tsai, C. Y. Huang, C. W. Ting, null Kuo-Shu Kao, null Ming-Yao Chen, Jimmy Tsang, null Sheng-Shu Yang, null Cho-Chyun An, null Shyh-Ming Chang
Publikováno v:
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
The problem with the excessive warpage of COG packages, so-called Mura effect (shadow along the edges of TFT-LCD), is one of major yield or reliability issues encountered in the TFT-LCD industry. To address this problem, the warpages of ACF-bonded CO
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32078c6382dec1f4dac617a816358bba
https://doi.org/10.1109/impact.2007.4433578
https://doi.org/10.1109/impact.2007.4433578
Autor:
Lin, C.K., Chih Chen, Shyh-Ming Chang, Chao-Chyun An, Hsiao Ting Lee, Kuo-Shu Kao, Jimmy Tsang, Sheng-Shu Yang
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p395-400, 6p