Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Sheng Wei Guan"'
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 62:987-996
A multidirectional trace current probe array is proposed to determine the distribution of electrostatic discharge (ESD) through near-field measurement in the time domain. In this article, a physical design of the probe array and a formula for overall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aae0ce160d0ce3931a082ae4f11be065
https://doi.org/10.1109/temc.2019.2953179
https://doi.org/10.1109/temc.2019.2953179
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
With the advancement of technology and the electronics is getting smaller and smaller, the probability of being affected by electrostatic discharge (ESD) has also increased. The failure and destruction of electronic products caused by high voltage in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4abc09db533ede04fe03b541258e44b7
https://doi.org/10.23919/icep.2019.8733475
https://doi.org/10.23919/icep.2019.8733475
Publikováno v:
2018 20th International Conference on Electronic Materials and Packaging (EMAP).
Recently, all the electrical device frequency becomes higher and higher in order to enable electronic products have better performance and become much faster such as CPUs, cellphones, smart watches $\dots$ etc. Almost all the products you can see aro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba7a30274246af923a12ec9e6c575da3
https://doi.org/10.1109/emap.2018.8660874
https://doi.org/10.1109/emap.2018.8660874
Autor:
Sheng-Wei Guan, Cheng-Dao Li, Sung-Mao Wu, Ming-Kun Hsieh, Chun-Ting Kuo, Li-Xuan Tsai, Chia-Hung Su
Publikováno v:
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).
In this paper, the verifications of two extraction methods for the electrical properties (dielectric constant: 8r and loss-tangent: tanδ) are presented. To verify the two extraction methods (Near-Field Technology method and Phase Delay method), a mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0a4cfc975f3211886b50c5d41f92aae
https://doi.org/10.1109/isemc.2018.8393868
https://doi.org/10.1109/isemc.2018.8393868
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
In this paper, a complete non-contact measurement coupling model is proposed and analyzed with a particular approach for coupling factor extraction, the factor is significant for near-field and non-contact techniques. First, a simple non-contact meas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f415cd20e766dd01268f3ee203960b2
https://doi.org/10.23919/icep.2018.8374648
https://doi.org/10.23919/icep.2018.8374648
Publikováno v:
2016 IEEE 5th Asia-Pacific Conference on Antennas and Propagation (APCAP).
This paper presents a design methodology of EMI/RFI suppression by SI/PI simulation at smartphone applications. In smartphones, the high speed transmission lines of display serial interface (DSI) at LCD panel are designed on a 2-layer flexible printe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed4ad64abb3ddab508a316f00f626e9d
https://doi.org/10.1109/apcap.2016.7843281
https://doi.org/10.1109/apcap.2016.7843281
Autor:
Sung-Mao Wu, Sheng-Wei Guan
Publikováno v:
Progress In Electromagnetics Research C. 15:187-199
This research uses innovative approaches for characteriz- ing spring probes, a flnal-test bottleneck applied to microwave pack- aging. The modeling method depends on conventional microwave on- wafer measurement. This paper compares the novel microwav
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa79c3acbb3cabe796e92d9e112d3345
https://doi.org/10.2528/pierc10060702
https://doi.org/10.2528/pierc10060702
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
In this study, a novel impedance match-able structure of QFP (Quad Flat Package) socket contactor is presented. Application property and design formulas of impedance matching varying contactor section length are focus in this paper. Besides, through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39e20680fe5bfa1e821689ea4477c145
https://doi.org/10.1109/icept.2010.5582366
https://doi.org/10.1109/icept.2010.5582366
Publikováno v:
Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f63495060be7727bf4c255c6b9a7a3c4
https://doi.org/10.7567/ssdm.2009.p-5-10
https://doi.org/10.7567/ssdm.2009.p-5-10
Publikováno v:
2008 International Conference on Microwave and Millimeter Wave Technology.
Fabrication and structure of a novel IPD (Integrated Passive Device) inductor are presented. In this paper, IPD inductor has been simulated by 3D EM simulator software, HFSS (High Frequency Structure Simulator). Performance of this inductor over 100
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f7b12e351a68974c4e3a02d2a8c9169
https://doi.org/10.1109/icmmt.2008.4540666
https://doi.org/10.1109/icmmt.2008.4540666