Zobrazeno 1 - 10
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pro vyhledávání: '"Sheng, Yufei"'
Autor:
Wang, Xiaoming, He, Jiajing, Wang, Ao, Zhang, Kun, Sheng, Yufei, Hu, Weida, Jin, Chaoyuan, Bao, Hua, Dan, Yaping
Publikováno v:
Physical Review Letters 2024
Er doped Si light emitting diodes may find important applications in the generation and storage of quantum information. These diodes exhibit an emission efficiency two orders of magnitude higher at reverse bias than forward bias due to impact excitat
Externí odkaz:
http://arxiv.org/abs/2401.05758
Autor:
Hu, Yue, Jia, Ru, Xu, Jiaxuan, Sheng, Yufei, Wen, Minhua, Lin, James, Shen, Yongxing, Bao, Hua
Advances in nanotechnology have facilitated the exploration of submicron thermal transport. At this scale, Fourier's law is no longer applicable, and the governing equation for thermal transport is the phonon Boltzmann transport equation (BTE). Howev
Externí odkaz:
http://arxiv.org/abs/2306.14181
Publikováno v:
In International Journal of Thermal Sciences February 2025 208
Akademický článek
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Akademický článek
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Publikováno v:
In Construction and Building Materials 20 January 2020 231
Akademický článek
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Akademický článek
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Autor:
Xia Y; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Zhang X; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Wang A; Institute of Condensed Matter and Nanosciences (IMCN), Université catholique de Louvain (UCLouvain), 1348 Louvain-la-Neuve, Belgium., Sheng Y; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Xie H; School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, People's Republic of China., Bao H; Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.
Publikováno v:
Journal of physics. Condensed matter : an Institute of Physics journal [J Phys Condens Matter] 2024 Nov 15; Vol. 37 (5). Date of Electronic Publication: 2024 Nov 15.
Autor:
Hu Y; Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Jia R; Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Xu J; Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Sheng Y; Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Wen M; Center for High Performance Computing, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Lin J; Center for High Performance Computing, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Shen Y; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China., Bao H; Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.; University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China.
Publikováno v:
Journal of physics. Condensed matter : an Institute of Physics journal [J Phys Condens Matter] 2023 Oct 12; Vol. 36 (2). Date of Electronic Publication: 2023 Oct 12.