Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Shen Hue Sun"'
Autor:
David Borowsky, Ingo Herrmann, Christoph Schelling, Shen Hue Sun, Daniel B. Etter, Franz Xaver Hutter, Joachim N. Burghartz, Fabian Utermohlen
Publikováno v:
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).
We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The pe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::030e61ccb8988b17fd9d138aa0ed52b5
https://doi.org/10.1109/memsys.2014.6765705
https://doi.org/10.1109/memsys.2014.6765705
Publikováno v:
2013 International Semiconductor Conference Dresden - Grenoble (ISCDG).
A model for the electrical behavior of pn-junction diodes biased in forward direction and used as a temperature sensitive device (TSD) in microbolometers is presented. It is based on the well-known Shockley equation extended by the ideality factor m.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5c74ef173de3423bcbf27e2e511e612
https://doi.org/10.1109/iscdg.2013.6656299
https://doi.org/10.1109/iscdg.2013.6656299
Autor:
Shen Hue Sun, Ingo Herrmann, Joachim N. Burghartz, Daniel B. Etter, Franz Xaver Hutter, Fabian Utermohlen
Publikováno v:
2013 International Semiconductor Conference Dresden - Grenoble (ISCDG).
A fabrication process for a thermo-diode microbolometer array is presented. The process is based on a sintered porous silicon (sPS) technique adopted from Chipfilm™ technology to enable vertical thermal insulation of the pixels. In addition, the pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::28dd3424c6ed2f10b14b63a20e13798a
https://doi.org/10.1109/iscdg.2013.6656311
https://doi.org/10.1109/iscdg.2013.6656311