Zobrazeno 1 - 10
of 20
pro vyhledávání: '"Shawn Canfield"'
Publikováno v:
Journal of the IEST. 64:42-49
In optimizing packaging design, the product’s fragility is qualified by a protype undergoing quantitative and qualitative tests that rely heavily on past knowledge and experiments. By the addition of finite element analysis (FEA), the product’s f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::921f5771ccc472d3974c3d5fffc88a94
https://doi.org/10.17764/1557-2196-64.1.42
https://doi.org/10.17764/1557-2196-64.1.42
Publikováno v:
Volume 5: Operations, Applications, and Components; Seismic Engineering; ASME Nondestructive Evaluation, Diagnosis and Prognosis (NDPD) Division.
This paper discusses the finite element analysis (FEA) methods used to analyze the performance of a mainframe computer’s structural frame under a standard seismic loading such as that defined by Telcordia NEBS Zone 4. Specialists in the earthquake
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0c3d95cd6c2de6a233b8303c1e97e22
https://doi.org/10.1115/pvp2022-84831
https://doi.org/10.1115/pvp2022-84831
Publikováno v:
Volume 8: Seismic Engineering.
Shorter development design schedules and increasingly dense product designs create difficult challenges in predicting structural performance of a mainframe computer’s structure. To meet certain certification benchmarks such as the Telcordia Technol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e9790dc0fc99aaa762509508bd09513
https://doi.org/10.1115/pvp2018-84200
https://doi.org/10.1115/pvp2018-84200
Autor:
Budy D. Notohardjono, John G. Torok, Khambati Suraush, Shawn Canfield, Robert K. Mullady, Jing Zhang
Publikováno v:
International Symposium on Microelectronics. 2015:000169-000178
Recent high-end server designs have included new Input / Output (I/O) printed circuit board (PCB) assemblies consisting of a variety of form factors, electronic design layouts, and packaging assembly characteristics. To insure the required functional
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6b43d88075ab704e12d888f7426e6ac
https://doi.org/10.4071/isom-2015-tp64
https://doi.org/10.4071/isom-2015-tp64
Publikováno v:
Volume 8: Seismic Engineering.
A typical mainframe computer rack is narrow, tall and long. In certain installations, during its functional operation, the server can be subjected to earthquake events. The rack is a steel structure joined together with steel rivets. One of the rack
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fe388968c2b934b4b0dffc7a7ae5f5e
https://doi.org/10.1115/pvp2017-65140
https://doi.org/10.1115/pvp2017-65140
Autor:
Brian Samuel Beaman, Shawn Canfield, William L. Brodsky, Mark K. Hoffmeyer, Arvind K. Sinha, John G. Torok, Yuet-Ying Yu, Jason R. Eagle, Theron L. Lewis
Publikováno v:
International Symposium on Microelectronics. 2014:000550-000560
Recent high-end server design trends have continued to challenge electronic packaging engineers to design and integrate larger form factor land grid array (LGA) attached modules within their assemblies. These trends have included the application of l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3303afc204d1a8016e61cb944560649
https://doi.org/10.4071/isom-wa65
https://doi.org/10.4071/isom-wa65
Publikováno v:
Volume 8: Seismic Engineering.
A mainframe computer’s structure consists of a frame or rack, drawers with central processor units, IO equipment, memory and other electronic equipment. The focus of this structural mechanical analysis and design is on the frame, earthquake stiffen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ae60c5cfc0a592a232aace539688241
https://doi.org/10.1115/pvp2016-63348
https://doi.org/10.1115/pvp2016-63348
Autor:
Donald W. Porter, Yuet-Ying Yu, William P. Kostenko, Jeffrey A. Zitz, John G. Torok, Peter W. Kelly, Kamal K. Sikka, Shawn Canfield, Xiaojin Wei, Allan C. Vandeventer
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Cooling high-end system processors has become increasingly more challenging due to the increase in both total power and peak power density in processor cores. Junction peak temperature at worst case corner conditions often establish the limits on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::850c36878860edb6933b401fb6f0fa15
https://doi.org/10.1109/itherm.2016.7517672
https://doi.org/10.1109/itherm.2016.7517672
Publikováno v:
International Symposium on Microelectronics. 2012:000818-000824
Recent industry trends to continue enabling increased server system performance and packaging density has driven the need to implement larger form factor hybrid land grid array (LGA) attached organic modules. In addition, given the need to package mu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dbd1476819db51f95987aec34ae84991
https://doi.org/10.4071/isom-2012-wp23
https://doi.org/10.4071/isom-2012-wp23
Autor:
Shawn Canfield, Mary Frecker
Publikováno v:
Structural and Multidisciplinary Optimization. 20:269-279
A method for the design of displacement amplifying compliant mechanisms for piezoelectric actuators is developed using a topology optimization approach. The overall stroke amplification or geometric advantage of the mechanism, and the overall mechani
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::424b5e94d0cc90a8ba9f806a464331ff
https://doi.org/10.1007/s001580050157
https://doi.org/10.1007/s001580050157