Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Shashank Shrikant Agashe"'
Autor:
Gaurav Sultania, Lakshmi Narayana Pedapudi, Gaurav Kumar, Shashank Shrikant Agashe, Sathyanarayanan Kulasekaran
Publikováno v:
2021 3rd International Conference on Management Science and Industrial Engineering.
A semiconductor fabrication facility (Fab) manufactures huge volume of wafers and chips. To sustain high production throughput and quality, fast and accurate Fab-In inspection and verification methods are required. These methods intake a lot of spect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f42c313303d75e88d9f81a490275a01f
https://doi.org/10.1145/3460824.3460855
https://doi.org/10.1145/3460824.3460855
Autor:
Shashank Shrikant Agashe, Lakshmi Narayana Pedapudi, Taehyoung Lee, Gaurav Kumar, Avadhut Dipakrao Chaudhari, Chan Woo Park
Publikováno v:
2021 10th International Conference on Industrial Technology and Management (ICITM).
Material spectroscopy (MS) is used to identify elemental composition of micro particles. Energy dispersive X-Ray spectroscopy (EDX or EDS) is one such method. EDX analysis of defects found during wafer inspection aids in performing their root cause a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcf98a283cc78e785adfd742274cde42
https://doi.org/10.1109/icitm52822.2021.00029
https://doi.org/10.1109/icitm52822.2021.00029
Autor:
Gaurav Kumar, Shashank Shrikant Agashe
Publikováno v:
2016 International Conference on Signal Processing and Communications (SPCOM).
A typical scene under the camera lens of a wafer inspection equipment consists of device features that are at different height relative to each other. To image such a scene, conventional camera systems within the equipment apply a single focus settin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d0c3c839aafbbcf0cf130652522a3e7
https://doi.org/10.1109/spcom.2016.7746617
https://doi.org/10.1109/spcom.2016.7746617