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pro vyhledávání: '"Shashank Shrikant Agashe"'
Autor:
Gaurav Sultania, Lakshmi Narayana Pedapudi, Gaurav Kumar, Shashank Shrikant Agashe, Sathyanarayanan Kulasekaran
Publikováno v:
2021 3rd International Conference on Management Science and Industrial Engineering.
A semiconductor fabrication facility (Fab) manufactures huge volume of wafers and chips. To sustain high production throughput and quality, fast and accurate Fab-In inspection and verification methods are required. These methods intake a lot of spect
Autor:
Shashank Shrikant Agashe, Lakshmi Narayana Pedapudi, Taehyoung Lee, Gaurav Kumar, Avadhut Dipakrao Chaudhari, Chan Woo Park
Publikováno v:
2021 10th International Conference on Industrial Technology and Management (ICITM).
Material spectroscopy (MS) is used to identify elemental composition of micro particles. Energy dispersive X-Ray spectroscopy (EDX or EDS) is one such method. EDX analysis of defects found during wafer inspection aids in performing their root cause a
Autor:
Gaurav Kumar, Shashank Shrikant Agashe
Publikováno v:
2016 International Conference on Signal Processing and Communications (SPCOM).
A typical scene under the camera lens of a wafer inspection equipment consists of device features that are at different height relative to each other. To image such a scene, conventional camera systems within the equipment apply a single focus settin
Autor:
Singh, Ramya Bagavath, Kumar, Gaurav, Sultania, Gaurav, Agashe, Shashank Shrikant, Sinha, Priya Ranjan, Chulmoo Kang
Publikováno v:
EAI Endorsed Transactions on Cloud Systems; 2019, Vol. 5 Issue 15, p1-7, 7p
Publikováno v:
2016 International Conference on Signal Processing & Communications (SPCOM); 2016, p1-5, 5p