Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Sharath Sridhar"'
Large pre-trained language models have recently gained significant traction due to their improved performance on various down-stream tasks like text classification and question answering, requiring only few epochs of fine-tuning. However, their large
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=arXiv_______::bead11f4a774b692e9c820af36253c79
http://arxiv.org/abs/2307.11764
http://arxiv.org/abs/2307.11764
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
Autor:
Wayne R. Johnson, Anto Raj, Michael J. Bozack, John L. Evans, D. Mark Carpenter, Thomas Sanders, Sharath Sridhar
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1082-1093
This paper offers a statistical methodology for evaluating Pb-free solder alloy performance for high–reliability products using Cox proportional regression analysis and provides a detailed application of the technique based upon a 15-mm BGA package
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9df1a869599f6a6fff61f3ae2acd9d98
https://doi.org/10.1109/tcpmt.2019.2909052
https://doi.org/10.1109/tcpmt.2019.2909052
Autor:
Sharath Sridhar Waikar, Thi Qui Nguyen
Publikováno v:
26th Annual Conference of the International Group for Lean Construction.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91abe6f521c776b43f2472ed7e25f1dc
https://doi.org/10.24928/2018/0216
https://doi.org/10.24928/2018/0216
Autor:
Sharath Sridhar, Sivasubramanian Thirugnanasambandam, John L. Evans, Wayne Johnson, Anto Raj, Seth Gordon
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Board level drop impact testing is one of the most important modes of evaluating the reliability of assemblies. This study examines the drop impact performance of no aged and isothermally aged flip chip packages on laminate assemblies for various dop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::453b7d9df645832bd7791964e85715fc
https://doi.org/10.1109/itherm.2016.7517590
https://doi.org/10.1109/itherm.2016.7517590
Autor:
Fadel M. Megahed, Thomas Sanders, Michael J. Bozack, Mark Carpenter, Sharath Sridhar, John L. Evans, Sivasubramanian Thirugnanasambandam, Derrick Stone, Wayne R. Johnson, Anto Raj, Seth Gordon, George T. Flowers
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In this experiment, the vibrational performance of various lead-free doped (micro-alloyed) solder paste alloys on 15mm BGA packages were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mitigate the effe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d2bda4f719a7b4c6c0c3b24ee396e4c
https://doi.org/10.1109/itherm.2016.7517685
https://doi.org/10.1109/itherm.2016.7517685
Autor:
John L. Evans, Michael J. Bozack, Fadel M. Megahed, Sharath Sridhar, Sivasubramanian Thirugnanasambandam, Mark Carpenter, Anto Raj, Seth Gordon, Wayne R. Johnson, Thomas Sanders
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In this experiment, the thermal performance of various lead-free doped solder paste alloys on leaded and leadless packages on laminate substrates were investigated. The Primary Goal of this test is to find a manufactureable solder paste that will mit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac5f8131bbf56e0c33fcf2349fd9774d
https://doi.org/10.1109/itherm.2016.7517683
https://doi.org/10.1109/itherm.2016.7517683