Výsledky vyhledávání - "Sharang, Sharang"

Akademický článek

Autor: Sharang, Sharang¹, Anzalone, Paul², Obona, Jozef Vincenc³

Publikováno v: Electronic Device Failure Analysis. Aug2019, Vol. 21 Issue 3, p4-6. 3p.

Delayering of 14 nm Node Technology IC with Xe Plasma FIB

Autor: Jozef Vincenc Oboňa, Tomáš Hrnčíř, Sharang Sharang, Marek Šikula, Andrey Denisyuk, Jiří Dluhoš

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c366f91a6b9a04040b2014356f981844
https://doi.org/10.1002/9783527808465.emc2016.5593

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Ultrafast nano-fabrication and analysis using Xe plasma-FIB-SEM microscope and its applications for Cu milling using the Rocking-stage

Autor: Abdelmalek Benkouider, Sharang Sharang, Tomaš Hrnčíř, Jozef Vincenc Oboňa, Jaroslav Jiruše, Edward Principe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d6c8ff3c6f3a679026caeac1115d137e
https://doi.org/10.1002/9783527808465.emc2016.5761

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Optimizing Gas-Assisted Processes for Ga and Xe FIB Circuit Edit Application

Autor: Lolita Rotkina, Eddie Chang, Josef V. Oboňa, Valery Ray, Sharang Sharang, Kevin Tolua

Publikováno v: International Symposium for Testing and Failure Analysis.

Despite commercial availability of a number of gas-enhanced chemical etches for faster removal of the material, there is still lack of understanding about how to take into account ion implantation and the structural damage by the primary ion beam dur

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c9e01b22a0be0ac8053a04fb0201f19e
https://doi.org/10.31399/asm.cp.istfa2016p0397

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