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pro vyhledávání: '"Shaogen Luo"'
Autor:
Guannan Yang, Shaogen Luo, Bo Luo, Yan Zuo, Shiwo Ta, Tingyu Lin, Zhaohui Zhao, Yu Zhang, Chengqiang Cui
Publikováno v:
International Journal of Smart and Nano Materials, Vol 13, Iss 4, Pp 543-560 (2022)
ABSTRACTConductive fillers made from metal nanoparticles offer many advantages for the fabrication of a variety of electronic devices, but when they have a porous structure, their poor conductivity limits their adoption in many applications. In this
Externí odkaz:
https://doaj.org/article/393d7da4246c40f187352f6d5040386d
Publikováno v:
Frontiers in Materials, Vol 9 (2022)
Microvia filling is a core interconnection technique in electronic manufacturing. Electroplating is the primary method used in the industry for filling microvias but also has the drawbacks of cumbersome procedures and toxic by-products. New microvia
Externí odkaz:
https://doaj.org/article/ec9c3f4a6429462abb5e6a24c1432f1e
Publikováno v:
Nanomaterials, Vol 12, Iss 7, p 1063 (2022)
In this work, we developed an eco-friendly and facile microvia filling method by using printing and sintering of Cu-Ag core-shell nano-microparticles (Cu@Ag NMPs). Through a chemical reduction reaction in a modified silver ammonia solution with L-His
Externí odkaz:
https://doaj.org/article/f6b8380d9d194dfd9f77961e208a480c
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Experiments and finite element simulations were carried out to explore the effect of laser power on the sintering temperature field and the characteristics of sintered copper nanoparticle paste. Pure copper nanoparticles with a size of 300 nm were pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f7293025fc518d505d2bc197ffa2e0a
https://doi.org/10.1109/icept50128.2020.9202923
https://doi.org/10.1109/icept50128.2020.9202923