Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Shaoan Wang"'
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 7094-7099 (2023)
The preparation of new solder joint materials for chip packaging by designing a variety of brazing material mixes has become one of the future research directions for solder joints. They added low melting point elements to traditional solder material
Externí odkaz:
https://doaj.org/article/e03a51e5016e406285a2615a4b103ab5
Autor:
Shaoan Wang, Xiangyu Chen, Keyu Luo, Hongzhi Zhou, Rongqing Li, Peng He, Kyung-Wook Paik, Shuye Zhang
Publikováno v:
Journal of Materials Research and Technology, Vol 27, Iss , Pp 5332-5339 (2023)
In recent years, in order to adapt to the trend of low-temperature assembly and integration, low-temperature hybrid solders with multiple elements added to the tin solder matrix have been investigated. In this regard, the morphology and size of inter
Externí odkaz:
https://doaj.org/article/f2d83c4cb05a4fa18cfc9f33eb76c6ad
Publikováno v:
e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 2, Iss , Pp 100052- (2022)
With the continuous reduction of chip feature size, the continuation of Moore's Law becomes increasingly difficult and heterogeneous integration has become one of the important orientations of electronic technology. Focusing on the issues including s
Externí odkaz:
https://doaj.org/article/5ca25ad91b784fc9ab91c27dce2eeded
Publikováno v:
Machines, Vol 11, Iss 1, p 3 (2022)
In robot-assisted oral surgery, the surgical tool needs to be fed into the target position to perform surgery. However, unmodeled extraoral and complex intraoral environments bring difficulties to motion planning. Meanwhile, the motion is operated ma
Externí odkaz:
https://doaj.org/article/0d8863ccfe24452b88deed79a6e28ba9
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 72:1-11
Publikováno v:
IEEE Transactions on Automation Science and Engineering. :1-11
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 71:1-11
Publikováno v:
2022 IEEE 5th International Electrical and Energy Conference (CIEEC).
Autor:
Hao Liu, Jiahao Liu, Shaoan Wang, Zezhu Jin, Shuyan Zhu, Rui Ma, Weiwei Zhang, Jianqiang Wang, Jin Li, Chengliang Song, Shuye Zhang, Hongtao Chen
Publikováno v:
Microelectronics Reliability. 135:114571
Publikováno v:
2018 IEEE 3rd International Conference on Integrated Circuits and Microsystems (ICICM).
It is a problem that the existing very fast transient overvoltage (VFTO) repeated strike simulation model doesn't take strike characteristics of the contact gap into account and the arc resistance model can not fully reflect the dynamic changes of th